2009
DOI: 10.1088/0960-1317/19/9/095010
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Dry etching of polydimethylsiloxane using microwave plasma

Abstract: This paper presents a new polydimethylsiloxane (PDMS) dry-etching method that uses microwave plasma. The applicability of the method for fabricating microstructures and removing residual PDMS is also verified. The etch rate of PDMS was dominantly influenced by the gas flux ratio of CF 4 /O 2 and the microwave power. While the PDMS etch rate increased as the flux ratio of CF 4 was increased, the etch rate decreased as the flux ratio of O 2 was increased. The maximum etch rate of 4.31 μm min −1 was achieved when… Show more

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Cited by 37 publications
(39 citation statements)
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“…This phenomenon can lead to irreversible cell damage during neural stimulation and electrode damage in certain areas of the electrode. Therefore, an electrode structure with more uniform current density distribution is required, which can be achieved by slanted-edge electrodes [12].…”
Section: Discussionmentioning
confidence: 99%
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“…This phenomenon can lead to irreversible cell damage during neural stimulation and electrode damage in certain areas of the electrode. Therefore, an electrode structure with more uniform current density distribution is required, which can be achieved by slanted-edge electrodes [12].…”
Section: Discussionmentioning
confidence: 99%
“…Then, the surface of the PDMS is etched by about 1 μm using a tetrabutylammonium fluoride (TBAF) solution and the sacrificial post is removed. Finally, the outline of the electrode is cut using a ND:YVO4 laser [12]. The detailed process sequence is shown in Figure 1.…”
Section: A Fabrication Process Of Proposed Slanted Electrodementioning
confidence: 99%
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