Drop test reliability assessment of leaded &amp; lead-free solder joints for IC packages

Chong, D.Y.R.; Ng, Kellin; Tan, J.Y.N.; Low, P.T.H.; Pang, J.H.L.; Che, F.X.

doi:10.1109/eptc.2004.1396606

Cited by 17 publications

(12 citation statements)

References 20 publications

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“…When V x → U, R x → ∞ (implies an open circuit), it indicates that the critical solder joint has failed. The open circuit (infinite resistance) was adopted as a failure criterion in this study [14].…”

Section: Board Level Drop Test and Results Analysismentioning

confidence: 99%

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Xing

Pang

2015

IEEE Trans. Device Mater. Relib.

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Board-level drop reliability test and analysis require dynamic characterization of the high strain-rate properties of the solder, along with solder joint failure tests. Relying on just the drop impact analysis of board-level dynamic response (i.e. G-levels and board bending strains) and an over-simplification of deformation response of solder joints (i.e. assuming elastic stress criteria) can lead to misleading conclusions in the physics-of-failure understanding in drop impact tests. In this work, impact tests were conducted with a split Hopkinson pressure bar (SHPB) test system to study the dynamic response of bulk solder materials. A finite element analysis (FEA) of drop impact was conducted by considering different solder constitutive models such as the elastic and strain ratedependent plastic model to investigate the effect of solder constitutive model on the dynamic response of the solder joint. The important finding of this study is that the constitutive model used has a major impact on the dynamic response of solder joint stress and strain results. Theoretically, it is predicted that the strain rate-dependent plastic model gave better correlation results than the simple elastic model. A solder joint reliability characterization using drop impact test with a clamped-clamped boundary condition was investigated for a plastic ball grid array (PBGA) assembly with Sn-Ag-Cu solder and 2 board surface finishes. In order to assess drop reliability of solder joint with different surface finishes, Charpy test was conducted to evaluate dynamic strength of soldered specimen using Sn-Ag-Cu solder and with or without Ni/Au plating. Index Terms-Board-level drop test, Charpy impact test, finite element modeling, Sn-Ag-Cu solder joint, strain rate-dependent model.

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Section: Board Level Drop Test and Results Analysismentioning

confidence: 99%

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Xing

Pang

2015

IEEE Trans. Device Mater. Relib.

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“…The growing use of portable electronics devices such as cell phone and PDA has led to increased concerns on drop impact related failures in electronic assemblies. The studies on impact drop test on lead-free solder joint reliability have been reported [2][3][4][5][6][7]. Brittle fracture of IMC caused by dynamic loading such as impact shock is the dominant failure mode [7].…”

Section: Introductionmentioning

confidence: 98%

Effect of thermal and electromigration exposure on solder joint board level drop reliability

Xu¹,

Pang²

2006

2006 8th Electronics Packaging Technology Conference

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The combined sequential reliability test of thermal cycling aging or electromigration test followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging and combined thermal-electromigration. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.

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“…However, in many package styles, such as ball grid arrays (BGAs), land grid arrays (LGAs), micro-lead frame (MLFs) and quad flat no-lead (QFNs), the Cu trace emanating from the solder pad may be the weakest failure site, particularly if the solder joint is copper-defined rather than mask-defined, and if there is a sudden neck in the copper trace with sharp re-entrant corners where the copper trace emanates from the solder pad [10,12]. This is particularly true in situations with cyclic mechanical loading, such as cyclic quasi-static bending, vibration and repetitive drop/shock [7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…This generally results in stiffer, more robust solder interconnects. Consequently, the mechanically weakest point in the chain becomes the traces on the PWA [7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

An adaptive Cu trace fatigue model based on average cross-section strain

Farley

Zhou

Dasgupta

et al. 2012

Microelectronics Reliability

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Drop test reliability assessment of leaded & lead-free solder joints for IC packages

Cited by 17 publications

References 20 publications

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Effect of thermal and electromigration exposure on solder joint board level drop reliability

An adaptive Cu trace fatigue model based on average cross-section strain

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