53rd Electronic Components and Technology Conference, 2003. Proceedings.
DOI: 10.1109/ectc.2003.1216265
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Drop impact survey of portable electronic products

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Cited by 81 publications
(41 citation statements)
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“…Of course, more rigorous analysis and FEM modelling using computers would be required during later phases of the design process, but until that time, analytical tools clearly have their strengths and uses, particularly if backed up with small-scale experiments to measure k p . Apart from this, the drop test facility used in this study shows its usefulness as an experimental tool: the guide-andrelease set-up employed allows reproducible drops across a range of contact angles, in accordance with the pioneering work of Goyal & Buratynski [9] and the improvements made by Lim et al [7]. The use of twin accelerometers as presented here appears to be a novel and promising extension of their work, particularly since it allows systematic study of product variables with respect to impact resistance.…”
Section: Discussionmentioning
confidence: 79%
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“…Of course, more rigorous analysis and FEM modelling using computers would be required during later phases of the design process, but until that time, analytical tools clearly have their strengths and uses, particularly if backed up with small-scale experiments to measure k p . Apart from this, the drop test facility used in this study shows its usefulness as an experimental tool: the guide-andrelease set-up employed allows reproducible drops across a range of contact angles, in accordance with the pioneering work of Goyal & Buratynski [9] and the improvements made by Lim et al [7]. The use of twin accelerometers as presented here appears to be a novel and promising extension of their work, particularly since it allows systematic study of product variables with respect to impact resistance.…”
Section: Discussionmentioning
confidence: 79%
“…Publications involving full products are more scarce: e.g. Lim et al [7] performed drop impact tests on cell phones and PDA's, but without analysis; Singh et al [8] combined analysis with simulations, but performed no experimental validation; Zhou et al [6] did both. Such studies are useful for examining the effects of small, 'steel safe' changes late in the product development process, but they are not directly suitable for supporting choices at earlier stages (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…[4] and Lim C. T. et al [5,6] to investigate drop impact response of several models of PDAs and mobile phones. Impact force, strains and level of acceleration induced at the PCB were measured and compared in different orientations.…”
Section: Introductionmentioning
confidence: 99%
“…This block is then hoisted to the desired drop height and released to undergo free fall. Just prior to impact, the product is quickly released from the grippers at the specified orientation.Comprehensive tests were conducted by Seah et al[4] and Lim C. T. et al [5,6] to investigate drop impact response of several models of PDAs and mobile phones. Impact force, strains and level of acceleration induced at the PCB were measured and compared in different orientations.…”
mentioning
confidence: 99%
“…Lim and Low [4] proposed a method to examine the drop impact responses of portable electronic products at different impact orientations and drop height. The impact behavior has been studied at the product level [5]. After comprehensive drop tests, failure analysis, and simulations on two ball grid array (BGA) packages at the board level, Tee, et al [6] developed a life prediction model for board level drop testing.…”
Section: Previous Workmentioning
confidence: 99%