DPSSL and FL pumps based on 980-nm telecom pump laser technology: changing the industry

Lichtenstein, N.; Schmidt, Berthold; Fily, A.; Weiss, S.; Arlt, Sebastian; Pawlik, Susanne; Sverdlov, B.; Müller, Jürgen; Harder, C.

doi:10.1117/12.558737

Cited by 20 publications

(6 citation statements)

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“…The front mirrors were coated with an antireflection (AR) layer of around 4% reflectivity, whereas the laser back mirrors had a high reflectivity (HR) coating. The laser diodes are mounted epi-side down on an AlN submount for efficient heat dissipation utilizing AuSn hardsolder technology [5] .…”

Section: Chip Design and Processingmentioning

confidence: 99%

High power pump laser diodes for 2μm fibre laser

Pawlik¹,

Todt²,

Moser³

et al. 2014

SPIE Proceedings

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We report on our recent developments at II-VI Laser Enterprise of laser diode sources for the 79x nm range. High power conversion efficiency in excess of 62% was demonstrated. For high power applications like Thulium fiber laser pumping we have achieved an output power of more than 12.5W in CW operation for 94 µm wide broad-area single-emitters. We added the functionality of wavelength stabilization to the laser diodes by using a distributed feedback grating (DFB). Locking has been obtained over the full current range between 1A and 4A tested so far with some margin for temperature variation. For efficient fiber laser pumping the laser diodes were integrated in a multi-emitter platform, achieving 38 W out of a 105 µm fiber within 0.15 NA.

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Section: Chip Design and Processingmentioning

confidence: 99%

High power pump laser diodes for 2μm fibre laser

Pawlik¹,

Todt²,

Moser³

et al. 2014

SPIE Proceedings

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“…High power diode lasers have found increased applications in industry, advanced manufacturing, scientific research, aerospace and medical therapy, etc [1,2]. With the improvement of output power, efficiency and reliability of high power diode lasers, more and more new applications have been enabled [3].…”

Section: Introductionmentioning

confidence: 99%

Effect of interface layer on the performance of high power diode laser arrays

et al. 2015

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Packaging is an important part of high power diode laser (HPLD) development and has become one of the key factors affecting the performance of high power diode lasers. In the package structure of HPLD, the interface layer of die bonding has significant effects on the thermal behavior of high power diode laser packages and most degradations and failures in high power diode laser packages are directly related to the interface layer. In this work, the effects of interface layer on the performance of high power diode laser array were studied numerically by modeling and experimentally.Firstly, numerical simulations using finite element method (FEM) were conducted to analyze the effects of voids in the interface layer on the temperature rise in active region of diode laser array. The correlation between junction temperature rise and voids was analyzed. According to the numerical simulation results, it was found that the local temperature rise of active region originated from the voids in the solder layer will lead to wavelength shift of some emitters. Secondly, the effects of solder interface layer on the spectrum properties of high power diode laser array were studied. It showed that the spectrum shape of diode laser array appeared "right shoulder" or "multi-peaks", which were related to the voids in the solder interface layer. Finally, "void-free" techniques were developed to minimize the voids in the solder interface layer and achieve high power diode lasers with better optical-electrical performances.

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“…Diode lasers themselves are a particularly attractive source platform as they offer a cheap, simple, compact, and efficient means to generate laser output across a broad spectrum, spanning the visible to the mid-infrared, directly from electrical current. While single-mode laser diodes are commercially available, continuous wave output powers remain limited to a few watts [2,3] due to high irradiances resulting from the small transverse dimensions required for single spatial mode operation. Tapered amplifiers can be used in conjunction with single mode laser diodes to increase continuous-wave powers up to several watts [4].…”

Section: Introductionmentioning

confidence: 99%

Fast-to-slow axis mode imaging for brightness enhancement of a broad-area laser diode array

Jones

Gopinath

2013

Opt. Express

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Broad-area laser (BAL) diodes have found use in numerous applications requiring multi-watt powers, but remain limited by poor spatial beam quality. A novel laser cavity that enhances the brightness of a BAL array has been demonstrated. Wavelength beam combining (WBC) is used to spatially overlap output from the emitters. Improved beam quality is achieved by imaging the fast-axis mode onto the slow axis of the BAL array. The brightness is enhanced twofold over a typical Littman-Metcalf WBC cavity, reaching 47 MW·cm(-2)·sr(-1) at an output power of 1.16 W.

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DPSSL and FL pumps based on 980-nm telecom pump laser technology: changing the industry

Cited by 20 publications

References 0 publications

High power pump laser diodes for 2μm fibre laser

High power pump laser diodes for 2μm fibre laser

Effect of interface layer on the performance of high power diode laser arrays

Fast-to-slow axis mode imaging for brightness enhancement of a broad-area laser diode array

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