Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

Park, Jong-Bae; Lu, A.C.W.; Chua, K.M.; Wai, L.L.; Lee, Jun-Ho; Kim, Joungho

doi:10.1109/lmwc.2006.880719

Cited by 58 publications

(23 citation statements)

References 9 publications

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“…J. Park had utilized a double-stacked EBG structure for 11.4 GHz noise stop bandwidth with -30dB suppression in SIP applications [17].…”

Section: Introductionmentioning

confidence: 99%

“…J. Park had utilized a double-stacked EBG structure for 11.4 GHz noise stop bandwidth with -30dB suppression in SIP applications [17].But all of these EBG structures have severe disadvantages that limit their applications in productions. For example, the EBG structures are usually very complicated for fabrication, and the performances are sensitive to the size changes of the shape and periodical distribution of any unit cell.…”

mentioning

confidence: 99%

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Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

Wang

Wan

et al. 2009

2009 11th Electronics Packaging Technology Conference

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System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in system on package is implemented with embedded capacitor material. It has good performance in noise isolation with a small size of 10mm*mm. The lowpass filter is designed and simulated by electromagnetic analysis software, HFSS. The insertion loss is below -70dB from1.5GHz to 10GHz. Then, the lowpass filter is serial with a surface mounted 47nH inductor, and can achieve noise suppression below-50dB from 50MHz to 10GHz, below -60dB from 140MHz to 10GHz, and below80dB from 600MHz to 10GHz. That is very promising for system on package application in mixed-signal systems. The structure can also be used in large scale backplanes or motherboards. IntroductionConsumer electronics market demands for smaller size, lower cost, and higher level of integration have continued to drive the electronic systems to be convergent, and system on package (SOP) become an encouraging solution to improve circuit performance and reduce the system real estate [1]. SOP is more than an IC package containing multiple die, and seeks to integrate multiple system functions into one compact, lightweight, thin-profile, low cost, high performance packaged system [2]. The system design may include RF and wireless devices (such as power amplifiers, switch/filter modules, GPS modules, Bluetooth modules), digital baseband solutions and controllers. In such a compact SOP approach, digital IC are placed extremely close to RF IC to reduce the package size, and then electromagnetic interference (EMI) and simultaneous switching noise from the digital IC will certainly interfere with the RF operation [3]. How to suppress the noise propagation is becoming one of major challenges for SOP design.Prior to this work, power delivery network (PDN) with electromagnetic band gap (EBG) was considered to be a promising noise suppression technology [4][5][6][7]. To reduce the physical size and improve the performance of EBG structure, high dielectric constant embedded capacitor thin film material had also been employed [8][9][10]. But Most EBG structures had been developed for large scale backplane or motherboard applications [11][12][13][14][15]. Of course, some researchers had presented a few EBG solutions for packages. E. Song et al. had presented a spiral-patch EBG for < 5GHz SSN suppression in mixed-signal SIP [16]. J. Park had utilized a double-stacked EBG structure for 11.4 GHz noise stop bandwidth with -30dB suppression in SIP applications [17].But all of these EBG structures have severe disadvantages that limit their applications in productions. For example, the EBG structures are usually very complicated for fabrication, and the performances are sensitive to the siz...

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“…J. Park had utilized a double-stacked EBG structure for 11.4 GHz noise stop bandwidth with -30dB suppression in SIP applications [17].…”

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

Wang

Wan

et al. 2009

2009 11th Electronics Packaging Technology Conference

View full text Add to dashboard Cite

show abstract

“…An EBG structure with meander lines is possible to not only extend the bandgap, but also decrease the lower edge of the bandgap [10]. A double-stacked EBG structure was enabled by combining two EBG layers embedded between the power and ground planes [11]. This structure significantly extends the noise isolation bandwidth.…”

Section: Introductionmentioning

confidence: 99%

An Embedded Isolation Moat Structures With Wide Stopband and Low Parasitic Effect for Elimination Simultaneous Switching Noise

Chang¹,

Houng²,

Wang³

et al. 2009

PIER Letters

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Abstract-In this letter, we use two embedded isolation moats which have different size to obtain the wide stopband elimination performance. The proposed structure is realized by embedding the double isolation moats between power and ground planes. The suppression frequency range of the proposed structure is from 1.2 to 7.2 GHz and the peak noise improvement in time domain is 36%. Furthermore, the proposed structure uses two elimination cells to avoid the parasitic effect generated in the frequency range of several hundred MHz.Corresponding author: M.-P. Houng (mphoung@eembox.ncku.edu.tw). 92Chang et al.

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“…Since a multilayer board usually has a lot of signal layers, double stacked EBG structure is used [9]. Double stacked EBG in [9] had the two EBG layers which had different bandgaps from using different cell sizes.…”

Section: Introductionmentioning

confidence: 99%

“…Double stacked EBG in [9] had the two EBG layers which had different bandgaps from using different cell sizes. In this case, the two EBG layers have same bandgap.…”

Section: Introductionmentioning

confidence: 99%

Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board

Hwang

Park

Kim

et al. 2009

2009 20th International Zurich Symposium on Electromagnetic Compatibility

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Signal via transition is inevitable in backplane multi-layer board for high density routing. And a significant simultaneous switching noise (SSN) coupling to a signal occurs through the signal via transition.In this paper, we present suppression method of the SSN noise coupling caused by via transition in multi-layer backplane board using electromagnetic bandgap (EBG) structure. EBG structures are vertically located around a signal via to provide the low power/ground impedance area. The low power/ground impedance area suppresses the noise propagation and reduces the SSN noise coupling. It is shown that, within the stopband, the power/ground impedance at the position of the signal via with EBG structures is free from the power/ground planes cavity resonance, and the SSN coupling in single-ended and differential signaling is suppressed.

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Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

Cited by 58 publications

References 9 publications

Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

An Embedded Isolation Moat Structures With Wide Stopband and Low Parasitic Effect for Elimination Simultaneous Switching Noise

Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board

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