2002
DOI: 10.1016/s0013-4686(02)00683-7
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Double-pulse technique as an electrochemical tool for controlling the preparation of metallic nanoparticles

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Cited by 144 publications
(136 citation statements)
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“…A definite influence of increasing growth time on structure of silver nanoparticles is shown in Figure 2c, which led to increase in particle size and nanoparticle aggregation. These conclusions are in agreement with former results [33,40].…”
Section: Electrodeposition Of Silver Nanoparticles On Cilesupporting
confidence: 94%
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“…A definite influence of increasing growth time on structure of silver nanoparticles is shown in Figure 2c, which led to increase in particle size and nanoparticle aggregation. These conclusions are in agreement with former results [33,40].…”
Section: Electrodeposition Of Silver Nanoparticles On Cilesupporting
confidence: 94%
“…The time interval of the pre-pulse is short relative to the duration of silver particle growth and nucleation occurs instantaneously. In order to have monodispersity in size and density of nanoparticles, the cathodic overvoltage for the second pulse should be chosen high enough to control particle growth but low enough to minimize the generation of new nuclei [40,53]. A definite influence of increasing growth time on structure of silver nanoparticles is shown in Figure 2c, which led to increase in particle size and nanoparticle aggregation.…”
Section: Electrodeposition Of Silver Nanoparticles On Cilementioning
confidence: 99%
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“…On the other hand, electrochemical deposition is an efficient method to prepare metal particles. It is widely used employing different strategies/methodologies, such as cyclic voltammetry [10,11], potential step deposition [12,13,14,15] and double-pulse [16,17,18]. Among these, potential step deposition (PSD) provides us a tool to control the amount of metal that is deposited, the number of metallic sites and their size to a fairly small scale.…”
Section: -Introductionmentioning
confidence: 99%
“…Finally, the separator accommodates the mechanical constraints of the pressure applied to the stack that otherwise would lead to the destruction of the brittle AAO membrane. Electrodeposition of Cu was carried out under a pulsed cathodic current, a technique applied for many years to the plating of metals or alloys 28 to avoid diffusion-limited deposition. We used a repeated sequence of 300 ms consisting of two steps.…”
mentioning
confidence: 99%