Double patterning compliant logic design

Ma, Yuangsheng; Sweis, Jason; Bencher, Chris; Deng, Yunfei; Dai, Huixiong; Yoshida, Hidekazu; Gisuthan, Bimal; Kye, Jongwook; Levinson, Harry

doi:10.1117/12.879846

Cited by 13 publications

(14 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The discrimination threshold was varied to obtain the Receiver Operating Characteristic (ROC) curve for the model. Figure 9 shows a comparison between ROCcurves of our model, random guess, and a multivariate linear 6 One explanation for this is that including both horizontal and vertical congestion already captures the same information given by L and T-shapes. 7 We use hyperbolic tangent-sigmoid for the hidden-layer activation function and a linear function for the output-layer activation function.…”

Section: Testing and Approach Validationmentioning

confidence: 93%

“…Based on training accuracy it was observed that horizontal congestion, vertical congestion and tips had good influence on the prediction accuracy. L and T-shapes were excluded from the feature set because they did not affect the training accuracy 6 .…”

Section: B Input Layout Descriptorsmentioning

confidence: 99%

“…Here, MP rules (i.e., coloring and overlay rules) are accounted for during cell-layout generation and conservative rules are used at the design/cell interface to avoid any possibility of a conflict after placement and routing. Designing with MP rules is believed to be a hassle and conservative rules are expected to have a significant cost in terms of area [5,6].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A methodology for the early exploration of design rules for multiple-patterning technologies

Ghaida

Sahu

Kulkarni

et al. 2012

Proceedings of the International Conference on Computer-Aided Design

View full text Add to dashboard Cite

Abstract-Double/Multiple-patterning (DP/MP) lithography in a multiple litho-etch steps process is a favorable solution for technology scaling to the 20nm node and below. Mask-assignment conflicts represent the biggest challenge for MP and limiting them through design rules is crucial for the adoption of MP technology. In this paper, we offer a methodology for the early evaluation and exploration of layout and MP rules intended for speeding up the rules-development cycle. Using a novel wiringestimation method, we create layout estimates with fine-grained congestion prediction. MP-conflicts are then predicted using a machine-learning approach. In this work, we demonstrate the use of the method for double-patterning lithography in litho-etchlitho-etch process; the methodology is more general, however, and can be applied for other multiple-patterning technologies including tripe/multiple-patterning with multiple litho-etch steps, selfaligned double patterning (SADP), and directed self-assembly. Results of testing the methodology on standard-cell layouts show an 81% accuracy in DP-conflicts prediction. The methodology was then used to explore DP and layout rules and investigate their effects on DP-compatibility and layout area. The methodology allows for rules optimization; for example, pushing the minimum tip-to-side same-color spacing rule value from 1.7× to 1.5× the minimum side-to-side spacing design rule (i.e., from 110nm down to 90nm) would more than double the number of DP-compatible cells in the library.

show abstract

Section: Testing and Approach Validationmentioning

confidence: 93%

Section: B Input Layout Descriptorsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A methodology for the early exploration of design rules for multiple-patterning technologies

Ghaida

Sahu

Kulkarni

et al. 2012

Proceedings of the International Conference on Computer-Aided Design

View full text Add to dashboard Cite

show abstract

“…In this approach, MP design rules (i.e., coloring and overlay rules) are imposed on standard-cell layout generation and conservative MP design rules are used at the design/cell interface to avoid any possibility of a conflict after placement and routing. Designing with MP rules is believed to be a hassle and conservative rules are expected to have a significant cost in terms of area [18,19]. Additionally, in a previous work [1], we develop a framework for design rules evaluation, UCLA_DRE, and use it to evaluate the density impact of using conservative MP rules for standard-cell layout generation that would virtually eliminate any possibility of MP conflicts.…”

Section: Role Of Design In Mp Technology Developmentmentioning

confidence: 99%

Role of Design in Multiple Patterning: Technology Development, Design Enablement and Process Control

Ghaida

Gupta

2013

Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE), 2013

View full text Add to dashboard Cite

Abstract-Multiple-patterning optical lithography is inevitable for technology scaling beyond the 22nm technology node. Multiple patterning imposes several counter-intuitive restrictions on layout and carries serious challenges for design methodology. This paper examines the role of design at different stages of the development and adoption of multiple patterning: technology development, design enablement, and process control. We discuss how explicit design involvement can enable timely adoption of multi-patterning with reduced costs both in design and manufacturing.

show abstract

“…Different double patterning processes may also introduce different DPT restrictions as discussed in earlier sections. Their impacts to design efficient need to be assessed in the design technology co-optimization process [9].…”

Section: Dpt Enablement In Design Flowmentioning

confidence: 99%

DPT restricted design rules for advanced logic applications

Deng

Yoshida

et al. 2011

SPIE Proceedings

Self Cite

View full text Add to dashboard Cite

Double patterning technology (DPT) provides the extension to immersion lithography before EUV lithography or other alternative lithography technologies are ready for manufacturing. Besides the additional cost due to DPT processes over traditional single patterning process, DPT design restrictions are of concerns for potential additional design costs. This paper analyzes design restrictions introduced by DPT in the form of DPT restricted design rules, which are the interface between design and technology. Both double patterning approaches, Litho-Etch-Litho-Etch (LELE) and Self-Aligned Double Patterning with spacer lithography (SADP), are studied. DPT design rules are summarized based on drawn design layers instead of decomposed layers. It is shown that designs can be made DPT compliant designs if DPT design rules are enforced and DPT coloring check finds no odd cycles. This paper also analyzes DPT design rules in the design rule optimization flow with examples. It is essential to consider DPT design rules in the integrated optimization flow. Only joint optimization in design rules between design, decomposition and process constraints can achieve the best scaled designs for manufacturing. This paper also discusses DPT enablement in the design flow where DPT aware design tools are needed so that final designs can meet all DPT restricted design rules.

show abstract

Double patterning compliant logic design

Cited by 13 publications

References 0 publications

A methodology for the early exploration of design rules for multiple-patterning technologies

A methodology for the early exploration of design rules for multiple-patterning technologies

Role of Design in Multiple Patterning: Technology Development, Design Enablement and Process Control

DPT restricted design rules for advanced logic applications

Contact Info

Product

Resources

About