2011
DOI: 10.1021/am101187n
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Double-Layer Imprint Lithography on Wafers and Foils from the Submicrometer to the Millimeter Scale

Abstract: In this paper, a thermal imprint technique, double-layer nanoimprint lithography (dlNIL), is introduced, allowing complete filling of features in the dimensional range of submicrometer to millimeter. The imprinting and filling quality of dlNIL was studied on Si substrates as a model system and compared to results obtained with regular NIL (NIL) and reverse NIL (rNIL). Wavy foils were imprinted with NIL, rNIL and dlNIL and the patterning results compared and discussed. With dlNIL, a new application possibility … Show more

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Cited by 6 publications
(5 citation statements)
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“…Small and large features can be patterned by hybrid solutions combining NIL and conventional photolithography (combined nanoimprint‐ and photolithography; CNP) 151. Simultaneous thermal imprinting from the sub‐micrometer to millimeter scale on foils is given by double‐layer NIL (dlNIL) 152…”
Section: Nanoimprint Lithographymentioning
confidence: 99%
“…Small and large features can be patterned by hybrid solutions combining NIL and conventional photolithography (combined nanoimprint‐ and photolithography; CNP) 151. Simultaneous thermal imprinting from the sub‐micrometer to millimeter scale on foils is given by double‐layer NIL (dlNIL) 152…”
Section: Nanoimprint Lithographymentioning
confidence: 99%
“…Most conventional methods, such as electron beam (e-beam) lithography and x-ray lithography, can produce nanoscale structures [6] but inherent low throughput has been a major problem in beam-based lithography. Nanoimprint lithography addresses the need for low-cost, high-resolution, large-area production and high throughput manufacturing [7], but it still needs a stamp mold manufactured by means of the ebeam. Nanosphere lithography and nanoporous aluminium oxide membranes have been demonstrated as an efficient way to produce nanoscale patterns over a large area with high throughput and low-cost, but long-range order is still not achieved.…”
Section: Introductionmentioning
confidence: 99%
“…This tendency has been sustained over the past several decades on the basis of continuing advancements in manufacturing technologies including optical lithography 2–5. However, photolithography is reaching a physical limit in resolution,3, 6, 7 and thus alternative technologies such as extreme ultraviolet (EUV) lithography, nanoimprint lithography, interference lithography, and directed self‐assembly (DSA) are emerging rapidly 2, 3, 8–16. DSA of block copolymers (BCPs) has recently attracted much attention as a promising candidate for next‐generation lithography due to its capacity to provide excellent resolution and scalability 3, 17–25.…”
mentioning
confidence: 99%