Distributed Optical Fiber Sensors for PCB-Strain Analysis

Gomes, M.E.; Cruz, Sílvia Manuela Ferreira; Lopes, Hélder; Arcipreste, Bruno; Magalhães, Roberto; Silva, Alexandre Ferreira da; Viana, J. C.

doi:10.1109/tie.2018.2885686

Cited by 13 publications

(3 citation statements)

References 18 publications

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“…Particularly, distributed OF sensing allows a multitude of monitoring points in a single OF (millimeter range), covering a high number of critical points over the PCB surface (fiber lengths of 1-3 m), at low costs (e.g., as compared to optical fiber Bragg grating (FBG) sensors). In a previous work, OF was investigated for strain measurements on PCBs, specifically using distributed sensing technology [8]. Specifically, OF strain measurements were taken on an in-circuit test (ICT) machine.…”

Section: Introductionmentioning

confidence: 99%

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

Leite,

Freitas,

Magalhães

et al. 2023

Sensors

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This study investigated the use of distributed optical fiber sensing to measure temperature and strain during thermomechanical processes in printed circuit board (PCB) manufacturing. An optical fiber (OF) was bonded to a PCB for simultaneous measurement of temperature and strain. Optical frequency-domain reflectometry was used to interrogate the fiber optic sensor. As the optical fiber is sensitive to both temperature and strain, a demodulation technique is required to separate both effects. Several demodulation techniques were compared to find the best one, highlighting their main limitations. The importance of good estimations of the temperature sensitivity coefficient of the OF and the coefficient of thermal expansion of the PCB was highlighted for accurate results. Furthermore, the temperature sensitivity of the bonded OF should not be neglected for accurate estimations of strains. The two-sensor combination model provided the best results, with a 2.3% error of temperature values and expected strain values. Based on this decoupling model, a methodology for measuring strain and temperature variations in PCB thermomechanical processes using a single and simple OF was developed and tested, and then applied to a trial in an industrial environment using a dynamic oven with similar characteristics to those of a reflow oven. This approach allows the measurement of the temperature profile on the PCB during oven travel and its strain state (warpage).

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Section: Introductionmentioning

confidence: 99%

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

Leite,

Freitas,

Magalhães

et al. 2023

Sensors

Self Cite

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“…Printed circuit board (PCB), as the basic mechanically supports of electronic devices, is widely used in circuit, radio frequency (RF), and other fields. [ 1,2 ] Copper is the most commonly used conductive material in the PCB structure due to its high electrical conductivity and matured manufacture techniques. [ 3 ] Despite the advantages, with the increasing demand of electronic products, metal waste is becoming a severe problem, as it can cause significant environment pollutions.…”

Section: Introductionmentioning

confidence: 99%

Sandwiched Graphene Clad Laminate: A Binder‐Free Flexible Printed Circuit Board for 5G Antenna Application

et al. 2020

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Printed circuit board (PCB), as the basic mechanically supports of electronic devices, is widely used in circuit, radio frequency (RF), and other fields. [1,2] Copper is the most commonly used conductive material in the PCB structure due to its high electrical conductivity and matured manufacture techniques. [3] Despite the advantages, with the increasing demand of electronic products, metal waste is becoming a severe problem, as it can cause significant environment pollutions. [4-6] Metal materials also suffer from high prices (because of their limited reserves), relatively poor flexibility, large density, and easily oxidized. As communication technologies developing, copper and other traditional metals-based PCB are becoming difficult to meet the new requirements for 5G communication devices, such as of being lightweight, flexible, miniaturized, and chemically stable under certain severe conditions. [7] Therefore, it is necessary to find a suitable material to realize metal substitution in the field of electronic products based on PCB. Many attempts have been made to find the right candidates for such substitution of copper so far. Recently, carbon-based allotropic materials, such as carbon nanotubes (CNTs), carbon fibers, graphene, and fullerenes, have been widely investigated in the fields of antennas, [8-10] sensors, [11,12] transistors, [13] and other electronic fields, [14,15] given that they are abundant in nature and their advanced properties of lightweight, corrosion resistant, and environmental friendly. For instance, CNTs not only have excellent mechanical properties, biocompatibility, and chemical stability, [16-18] but also have the disadvantages of low conductivity, complex film-forming process, and high contact resistance. [19-21] Fullerenes, such as the CNTs, also suffer from low conductivity and difficult film forming, [22] which lead to the problems of high loss and unsatisfactory performance

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“…"FFT" stands for FastFourier Transform[11] . A light source emits continuous light with linear tuning, and then a coupler divides the light into two signals[12] . One signal is described as the reference light, while the other is regarded as the probe light and is reflected by the random refractive index of FO cables[10] .…”

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confidence: 99%

Crack monitoring for municipal sewer pipes using DFOST

Yuan,

Liu,

Lin

2024

IOP Conf. Ser.: Earth Environ. Sci.

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The distributed fiber optic sensing technique (DFOST) provides an effective solution for long-term deformation monitoring of sewer pipelines under operation conditions due to occurrence of cracks. However, optical fibers attached on the pipeline wall might fail to capture all cracks as they are usually highly spatially scattered, resulting in misjudgment of pipe structural conditions. To address this challenge, this paper presents a novel deployment approach of distributed fiber optic monitoring system for pipeline cracks. First, the working principle of optical frequency domain reflectometry (OFDR) is explained. Second, the production of concrete pipe specimens with different optical fiber sensors deployment schemes is shown in detail. Finally, a comprehensive analyse of the results of visual inspection and fibre optic monitoring is completed. To evaluate the performance of this approach, experimental data from various cases were considered. The conclusion of this paper provides theoretical and empirical support for the application of distributed fiber optic sensors for pipeline cracks monitoring.

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Distributed Optical Fiber Sensors for PCB-Strain Analysis

Cited by 13 publications

References 18 publications

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

Sandwiched Graphene Clad Laminate: A Binder‐Free Flexible Printed Circuit Board for 5G Antenna Application

Crack monitoring for municipal sewer pipes using DFOST

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