2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023
DOI: 10.1109/ectc51909.2023.00121
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Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

I. Nathan
1
,
Nima Nejadsadeghi
2
,
Norifumi Kohama
3
et al.
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Cited by 6 publications
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Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Kang,
Iacovo,
D’havé
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Kang,
Iacovo,
D’havé
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
0
0
0
0
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Elucidating the mechanism of four corner voids in chip-on-wafer hybrid bonding

Hirano,
Hiratsuka,
Yoshioka
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction

Baek,
Han,
Han
et al. 2024
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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