JOM
 2024
DOI: 10.1007/s11837-024-06426-4
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Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder

Andromeda Dwi Laksono,
Yu-An Shen,
Ting Chen
et al.
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