Dissipating the heat generated in high-performance electronics using graphitic foam heat-sinks cooled with a dielectric liquid

Alhusseny, Ahmed; Al-Fatlawi, Ali Wadi Abbas; Al-Aabidy, Qahtan; Nasser, Adel; Al-Zurfi, Nabeel

doi:10.1016/j.icheatmasstransfer.2021.105478

Cited by 16 publications

(4 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In addition, adding nanoparticles to the water did not affect the heat sink's pumping capacity. Alhusseny et al [19] performed numerical research on graphitic foam heat sinks to develop convective heat transfer. The heat sinks were constructed of staggered foam baffles placed perpendicularly or parallel to the coolant stream to reduce pressure loss while maintaining high thermal dissipation.…”

Section: Greek Symbols Dhmentioning

confidence: 99%

Investigation of laminar forced convection using a different shape of a heat sink

Mohsen

Hamza

2022

QJES

View full text Add to dashboard Cite

Improving the thermal design of geometric Heat Sinks (HSs) reduces their size and weight and improves heat dissipation, hence enhancing the speed of electronic devices. In this numerical study, a novel thermal design of HSs is proposed by inserting various forms in order to obtain the optimum thermal design for this type of HSs. This study has two primary objectives: determining the influence of varying types of HSs while maintaining the volume of fins, and introducing new geometries such as circular fin and circular cut fin. The tests were conducted with a heat flux of 11.1 kW/m2 and a Reynolds number (Re) ranging from 2418.56 to 819.19. For forced convection, three-dimensional numerical simulations utilising the Navier–Stokes equations laminar model and energy equation are acquired using the commercially available COMSOL Multi-physics version 5.6a CFD software. The results indicate that. A comparison analysis of HSs with different geometries revealed that the circular-cut shape exhibited the highest thermal efficiency, as measured by the Nusselt number about 153 as well as the heat transfer coefficient and the minimum thermal resistance.

show abstract

Section: Greek Symbols Dhmentioning

confidence: 99%

Investigation of laminar forced convection using a different shape of a heat sink

Mohsen

Hamza

2022

QJES

View full text Add to dashboard Cite

show abstract

“…The key factors desired to fulfil in the applications of thermal management are high thermal conductivity, high compactness, low weight, and reasonable pressure loss. Such unique hydrothermal features are already in the DNA of either open-core foams formed from highly conductive materials such as metal-or graphite foams (Alhusseny, Al-Fatlawi, et al, 2021). Open-cell metal foams have, for instance, been successfully employed in diversity of thermal applications including heat exchangers (Alhusseny, Turan and Nasser, 2017), latent heat thermal energy storage units (Alhusseny et al, 2020), and the cooling of turbine blades (Al-Aabidy, as well as electrical generators (Alhusseny et al, 2015).…”

Section: Introductionmentioning

confidence: 99%

Graphite Foam Structures as an Effective Means to Cool High-Performance Electronics

Alhusseny,

Al-Aabidy,

Al-Zurfi

et al. 2024

Kufa J. Eng.

Self Cite

View full text Add to dashboard Cite

Due to their unique heat transfer features, graphite foams are used in the current analysis to form heat sinks effective enough to dissipate extreme heat generated within high-performance electronics. The heat sinks proposed are formed from foamed-baffles arranged either in parallel or perpendicular to the coolant paths through the staggered slots in between to alleviate the penalty of pressure drop while maintaining high heat dissipation capability. Two different sorts of dielectric coolants namely, air and the FC-3283 electronic liquid developed by 3MTM, have been utilized to directly dissipate the heat generated. The feasibility of the currently proposed heat sinks has been examined numerically based on the volume averaging concept of porous media employing the local thermal non-equilibrium model to account for interstitial heat exchange between the foam solid matrix and the fluid particles flowing across. A wide range of design parameters has been tested including the heat sink configuration along with structural characteristics of the graphite foam used. It has been found that foam baffles oriented perpendicular to the path of coolant flow can dissipate heat by about 50% better than those parallel to it, but with higher pressure losses. It has also been found that heat dissipation capability, for a certain orientation of baffles, can be improved by up to 100% when the foam pore size is doubled with outstanding saving in pressure losses by up to 300%. The impact of operating conditions, including the coolant flowrate and the heat flux applied, has also been inspected. The currently proposed heat sinks have been found efficient to meet the thermal demands of high-performance electronics and sweep away the extreme heat generated there with reasonable cost of pressure drop, where the proper selection of design parameters in light of the operating conditions applied can prevent the emergence of hot spots entirely. Extreme operating conditions, i.e. with heat density of up to 10W/cm2 for air-cooled heat sinks and 100W/cm2 for those cooled with FC-3283, can be well managed when a heat sink is configured from baffles that are oriented perpendicularly to the coolant flow path and formed of graphite foam having low porosity (∅=0.8) and larger pore size

show abstract

“…The physics of transient heat transfer allows one to evaluate the dynamics of energy movements for bodies subjected to changes in temperature, enabling the analysis of the heat flux, temperature history, and temperature rate of different processes. Transient heat transfer problems have significant applications in food processing [1,2], alternative energies [3,4], oil and gas [5], metallurgical processes [6,7], metallography [8,9], infrastructure materials [10,11], and electronics and semiconductor cooling [12][13][14], among others. These applications require analysis of multiple parameters, e.g., time-dependent boundary conditions [15], temperature-dependent thermo-mechanical properties [16,17], and evolving geometries [18] to guide the design of components.…”

Section: Introductionmentioning

confidence: 99%

“…This procedure is analogous to the perturbation of a constant parameter. Finally, Equation (13). is used to obtain the numerical sensitivities.…”

mentioning

confidence: 99%

Sensitivity Analysis for Transient Thermal Problems Using the Complex-Variable Finite Element Method

et al. 2022

View full text Add to dashboard Cite

Solving transient heat transfer equations is required to understand the evolution of temperature and heat flux. This physics is highly dependent on the materials and environmental conditions. If these factors change with time and temperature, the process becomes nonlinear and numerical methods are required to predict the thermal response. Numerical tools are even more relevant when the number of parameters influencing the model is large, and it is necessary to isolate the most influential variables. In this regard, sensitivity analysis can be conducted to increase the process understanding and identify those variables. Here, we combine the complex-variable differentiation theory with the finite element formulation for transient heat transfer, allowing one to compute efficient and accurate first-order sensitivities. Although this approach takes advantage of complex algebra to calculate sensitivities, the method is implemented with real-variable solvers, facilitating the application within commercial software. We present this new methodology in a numerical example using the commercial software Abaqus. The calculation of sensitivities for the temperature and heat flux with respect to temperature-dependent material properties, boundary conditions, geometric parameters, and time are demonstrated. To highlight, the new sensitivity method showed step-size independence, mesh perturbation independence, and reduced computational time contrasting traditional sensitivity analysis methods such as finite differentiation.

show abstract

Dissipating the heat generated in high-performance electronics using graphitic foam heat-sinks cooled with a dielectric liquid

Cited by 16 publications

References 32 publications

Investigation of laminar forced convection using a different shape of a heat sink

Investigation of laminar forced convection using a different shape of a heat sink

Graphite Foam Structures as an Effective Means to Cool High-Performance Electronics

Sensitivity Analysis for Transient Thermal Problems Using the Complex-Variable Finite Element Method

Contact Info

Product

Resources

About