The growing prevalence of methicillin-resistant Staphylococcus aureus (S. aureus) infections necessitates a greater understanding of their initial
adhesion to medically relevant surfaces. In this study, the influence
of the mechanical properties and oligomer content of polydimethylsiloxane
(PDMS) gels on the initial attachment of Gram-positive S. aureus was explored. Small-amplitude oscillatory
shear rheological measurements were conducted to verify that by altering
the base to curing (B:C) ratio of the commonly used Sylgard 184 silicone
elastomer kit (B:C ratios of 60:1, 40:1, 10:1, and 5:1), PDMS gels
could be synthesized with Young’s moduli across four distinct
regimes: ultrasoft (15 kPa), soft (30 kPa), standard (400 kPa), and
stiff (1500 kPa). These as-prepared gels (unextracted) were compared
to gels prepared from the same B/C ratios that underwent Soxhlet extraction
to remove any unreacted oligomers. While the Young’s moduli
of unextracted and extracted PDMS gels prepared from the same B:C
ratio were statistically equivalent, the associated adhesion failure
energy statistically decreased for the ultrasoft gels after extraction
(from 25 to 8 J/mm2). The interactions of these eight well-characterized
gels with bacteria were tested by using S. aureus SH1000, a commonly studied laboratory strain, as well as S. aureus ATCC 12600, which was isolated from a human
lung infection. Increased S. aureus inactivation occurred only when the bacteria were incubated directly
on top of the unextracted gels prepared at high B:C ratios (40:1 and
60:1), whereas none of the extracted gels (no unreacted oligomers)
had significant levels of inactivated bacteria. S.
aureus adhered the least to the stiffest extracted
PDMS gels (no unreacted oligomers) and the most to soft, unextracted
PDMS gels (with ∼17% unreacted oligomers). These findings suggest
that both unreacted oligomers and Young’s moduli are important
material factors to consider when exploring the attachment behavior
of Gram-positive S. aureus to hydrophobic
elastomer gels.