2018
DOI: 10.1109/tns.2018.2874191
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Displacement Damage in CMOS Image Sensors After Thermal Neutron Irradiation

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Cited by 14 publications
(8 citation statements)
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“…FOXFETs are fabricated in a 0.5‐μ$\umu$m CMOS process which, on top of the polysilicon gate, have a $\simeq$0.5‐μ$\umu$m borophosphosilicate glass (BPSG) layer, which is used with chemical–mechanical polishing during fabrication to planarize the silicon wafer before growing the metal layers. BPSG has generally a 3% in weight of natural boron, which has been reported to capture thermal neutrons causing single event effects in CMOS circuits or displacement damage in CMOS image sensors 48 …”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…FOXFETs are fabricated in a 0.5‐μ$\umu$m CMOS process which, on top of the polysilicon gate, have a $\simeq$0.5‐μ$\umu$m borophosphosilicate glass (BPSG) layer, which is used with chemical–mechanical polishing during fabrication to planarize the silicon wafer before growing the metal layers. BPSG has generally a 3% in weight of natural boron, which has been reported to capture thermal neutrons causing single event effects in CMOS circuits or displacement damage in CMOS image sensors 48 …”
Section: Discussionmentioning
confidence: 99%
“…BPSG has generally a 3% in weight of natural boron, which has been reported to capture thermal neutrons causing single event effects in CMOS circuits or displacement damage in CMOS image sensors. 48 We repeated the GEANT4 simulations of front and back irradiation adding the BPSG layer on top of the PolySilicon gate of the FOXFETs. The dose obtained on the FOXFET layer was negligible compared to the dose on the FOXFET when the thinnest 3-μm CL was applied.…”
Section: Effect Of Boron Present In the Foxfet On Neutron Sensitivitymentioning
confidence: 99%
“…The integrated circuit used in this work is the APTINA MT9M001, which is a 1/2-inch CMOS monochrome active-pixel image sensor composed by 1280 × 1024 pixels with 5.2 𝜇m × 5.2 𝜇m pitch [24]. The sensor active area is covered with approximately 3.7 𝜇m of metal layers -embedded in an inter-metal dielectric-, and a layer of approximately 3.8 𝜇m of polymers which form the micro-lenses of each pixel [13].…”
Section: The Cmos Sensorsmentioning
confidence: 99%
“…There are difficulties to place neutron detectors based on semiconductor into reactor pools: On one hand, most of the devices used in NR are sensitive to gamma rays, this hinders their use in underwater facilities because the samples and the reactor core generates high fluxes of photons which can produce a high undesirable counting rate, and a subsequent detector saturation. On the other hand, the high doses of thermal neutrons and gamma photons present in these environments would produce serious damage in semiconductor detectors, reducing considerably its lifespan [13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…There are difficulties to place neutron detectors based on semiconductor into reactor pools: on one hand, most of the devices used in NR are sensitive to gamma rays, this hinders their use in underwater facilities because the samples and the reactor core generates high fluxes of photons which can produce a high undesirable counting rate, and a subsequent detector saturation. On the other hand, the high doses of thermal neutrons and gamma photons present in these environments would produce serious damage in semiconductor detectors, reducing considerably its lifespan [13][14][15].…”
Section: Jinst 17 P02004mentioning
confidence: 99%