“…FOXFETs are fabricated in a 0.5‐
m CMOS process which, on top of the polysilicon gate, have a
0.5‐
m borophosphosilicate glass (BPSG) layer, which is used with chemical–mechanical polishing during fabrication to planarize the silicon wafer before growing the metal layers. BPSG has generally a 3% in weight of natural boron, which has been reported to capture thermal neutrons causing single event effects in CMOS circuits or displacement damage in CMOS image sensors
48 …”