Discontinuous structural phase transition of Sn–Bi melts

Li, Mingyang; Geng, Haoran; Long, Fang; Zuo, Min; Liu, Rongxue; Lu, Shujing

doi:10.1016/j.molliq.2015.01.005

Cited by 19 publications

(2 citation statements)

References 28 publications

(27 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There were suggestions that liquid-liquid phase transitions occur in liquid P [36], Sn-Bi melt [37], alumina [38] and C [39], and also, may take place in Fe [40], Fe-Cr [41] and Fe-B alloys [42]. There are also reasons to consider that supercooled liquid silicon undergoes a first-order phase transition, from a fragile, dense liquid to a strong, low-density liquid with nearly tetrahedral local coordination at 1060 K [43].…”

Section: Introductionmentioning

confidence: 99%

Structural changes in liquid Fe and Fe–B alloy on cooling

Louzguine-Luzgin

Georgarakis

Tsarkov

et al. 2015

Journal of Molecular Liquids

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Structural changes in liquid Fe and Fe–B alloy on cooling

Louzguine-Luzgin

Georgarakis

Tsarkov

et al. 2015

Journal of Molecular Liquids

View full text Add to dashboard Cite

“…During the electromigration process, the resistance changes as atoms undergo movement. As the temperature of the solder joint increases, the resistivity of the entire joint also increases [ 45 , 46 ]. In Figure 6 , it is evident that variations in the SnBi composition ratio led to changes in resistance.…”

Section: Defects Induced By Electromigration Of Snbi Alloy On Cu Matrixmentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

View full text Add to dashboard Cite

Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

show abstract

Structure and Physical Properties of Liquid Metal

2022

Liquid Metals

View full text Add to dashboard Cite

Discontinuous structural phase transition of Sn–Bi melts

Cited by 19 publications

References 28 publications

Structural changes in liquid Fe and Fe–B alloy on cooling

Structural changes in liquid Fe and Fe–B alloy on cooling

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Structure and Physical Properties of Liquid Metal

Contact Info

Product

Resources

About