2011
DOI: 10.1088/1009-0630/13/6/06
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Discharge Properties of High-Power Pulsed Unbalanced Magnetron Sputtering

Abstract: High-power pulsed magnetron sputtering (HPPMS or HiPIMS) is an emerging coating technology that produces very dense plasmas and highly ionized sputtering atoms. This paper is focused on discharge properties, unbalanced features and temporal evolution of pulse current of the HPPMS discharge. A hollow cathode was used to suppress the scattering of charges. A coaxial coil surrounding the target was used to control the breakdown voltage and pulse repetition frequency by varying the coil current. A Langmuir probe a… Show more

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Cited by 4 publications
(3 citation statements)
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“…Magnetron sputtering is a famous physical vapor deposition method. Technological developments of magnetron sputtering system have made it widely used in the film deposition [1][2][3][4][5][6]. The ion energy and ion fluxes to the substrate can make strong influence on the growth of the film [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…Magnetron sputtering is a famous physical vapor deposition method. Technological developments of magnetron sputtering system have made it widely used in the film deposition [1][2][3][4][5][6]. The ion energy and ion fluxes to the substrate can make strong influence on the growth of the film [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…Magnetron sputtering is an important technology for deposition of films [6][7][8][9][10][11] and an attractive alternative for preparing Ag films [12][13][14][15][16]. The growth and structure of sputtered Ag films depend on the energy and flux of the ions impacting the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…The motivation for preparing silicon on Ag films using VHF magnetron sputtering comes from the following facts. First, magnetron sputtering is an important technology for film deposition [13][14][15][16], and for the epitaxial growth of Si films [17][18][19][20]. Second, VHF magnetron sputtering discharge can produce ions with higher energy and very low flux [21][22][23], and thus the quantity of sputtered Si and the growth of silicon can be controlled well.…”
Section: Introductionmentioning
confidence: 99%