2004
DOI: 10.1063/1.1650877
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Directed growth of nickel silicide nanowires

Abstract: Deposition of nickel silicide nanowires has been achieved in the temperature range of 320 to 420°C by decomposition of silane on nickel surfaces. The substrates consisted of Ni foils and thin Ni films (ϳ10-100 nm) evaporated on 1-m-thick layers of SiO 2 predeposited on Si wafers. Nanowire growth between two metal pads was achieved with aid of an electric field. It was found that thinner diameter nanowires were produced at low temperatures and that the density of the nanowires was dependent on the reactor press… Show more

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Cited by 93 publications
(93 citation statements)
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“…The low growth temperature from 320 to 420 °C is accomplished by the decomposition of silane gas on Ni surfaces to make different composition (NiSi, Ni 2 Si, and Ni 3 Si 2 ) of nanowires (Decker et al, 2004). Similar growth was also reported but Ni gradient was appeared through a nanowires.…”
Section: Ni Silicide Nanowire Growth By Chemical Methodsmentioning
confidence: 53%
See 2 more Smart Citations
“…The low growth temperature from 320 to 420 °C is accomplished by the decomposition of silane gas on Ni surfaces to make different composition (NiSi, Ni 2 Si, and Ni 3 Si 2 ) of nanowires (Decker et al, 2004). Similar growth was also reported but Ni gradient was appeared through a nanowires.…”
Section: Ni Silicide Nanowire Growth By Chemical Methodsmentioning
confidence: 53%
“…Other results on NiSi nanowires were reported as about 370 µΩ·cm from Ti/Au deposition . or nonlinear high resistance characteristics from Pt deposition (Dong et al, 2005;Decker et al, 2004) implying that there is an effect of foreign metal use or poor adhesion between electrodes and nanowire. The common method by others to characterize a nanoscale structure is to detach it to an insulation layer, such as SiO 2 , then make contacts above it.…”
Section: Nanowire Interconnect: Nanobridgementioning
confidence: 99%
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“…Silicon nanowires (SiNWs) are considered attractive for micro-electronics, [1][2][3][4] optoelectronics, 5,6) micro-chemical sensors, 1) and micro-component devices 7) due to their quantum confinement effects and peculiar structures with a high aspect ratio in nanosize. SiNWs have been formed using various methods, such as laser ablation, 8) thermal evaporation, 9,10) solid reaction, 11) and chemical vapor deposition (CVD).…”
Section: Introductionmentioning
confidence: 99%
“…They are typically used as contacting materials on gate, source and drain regions in the CMOS process and also show promise in new applications such as fully silicided (FUSI) gates [4], and nano-wires [5]. Historically, three silicides have been used in micro-electronics as contacting materials, due to their low resistivity: initially, TiSi 2 was used, but due to the difficulty of growing the low resistivity C54 phase of TiSi 2 in narrow lines, the transition to CoSi 2 was made.…”
Section: Introductionmentioning
confidence: 99%