“…For example, there have been demonstrations of directed assembly of various morphologies, high degrees of perfection, registration, improved line edge roughness (LER) and critical dimension (CD) control, and accelerated annealing. [11,[15][16][17][18][19][20] Additionally, blockcopolymer films have been assembled into patterns with a variety of geometric complexity, [14,[21][22][23] including essential IC geometries, such as terminations, bends, jogs, junctions, and combined structures, [18,[22][23][24][25][26] required by the semiconductor design community. [24,25,27] Recent publications have also illustrated the ability of block copolymer films to provide enhanced resolution via directed assembly with density multiplication on chemical [17,28,29] and topographical patterns.…”