2019
DOI: 10.1002/adfm.201907907
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Direct Writing Micropatterns with a Resolution up to 1 µm

Abstract: Solution processes have been widely used to fabricate micropatterned surfaces for its mild operation conditions. However, current approaches suffer from limitations of either low resolution or high cost. Here, a facile approach is proposed for direct writing micropatterns with a resolution up to ≈1 µm using a unit of triple conical fibers with the side-by-side parallel arrangement. With this unit, the resolution of the micropatterns can be mainly controlled by the single central conical fiber, with one side of… Show more

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Cited by 8 publications
(4 citation statements)
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“…The as‐developed UHT‐FE exhibits a rather good spatial electric uniformity with a standard deviation of merely 3.1, by measuring the sheet resistance values in 9 local regions in an area of 3 × 3 cm 2 (Figure 1g,h). As we previously reported, [ 36 ] the unit of triple conical fibers (tri‐CFs, Figure S1, Supporting Information) has the capacity of the steady and continuous transferring liquid onto the target substrate in a controllable way. By moving the tri‐CFs unit directionally along the direction parallels with the L direction (WD⫽L), the high‐resolution and highly‐aligned AgNWs micro‐lines crossing‐network (HRHA‐CA‐AgNWs) can be directly written on the target substrate with the width resolution of AgNWs micro‐lines depending on the vertical height (H) (Figure 1i, Figure S2, Supporting Information).…”
Section: Resultsmentioning
confidence: 81%
“…The as‐developed UHT‐FE exhibits a rather good spatial electric uniformity with a standard deviation of merely 3.1, by measuring the sheet resistance values in 9 local regions in an area of 3 × 3 cm 2 (Figure 1g,h). As we previously reported, [ 36 ] the unit of triple conical fibers (tri‐CFs, Figure S1, Supporting Information) has the capacity of the steady and continuous transferring liquid onto the target substrate in a controllable way. By moving the tri‐CFs unit directionally along the direction parallels with the L direction (WD⫽L), the high‐resolution and highly‐aligned AgNWs micro‐lines crossing‐network (HRHA‐CA‐AgNWs) can be directly written on the target substrate with the width resolution of AgNWs micro‐lines depending on the vertical height (H) (Figure 1i, Figure S2, Supporting Information).…”
Section: Resultsmentioning
confidence: 81%
“…To date, various solution processes have been developed for preparation of QD patterned arrays, such as inkjet printing, film lithography, transfer printing, blade coating with a mask, , Chinese brush, fiber array printing, electrodeposition, Langmuir–Blodgett (LB) printing, electrospinning, hydrophilic mask, and others . These methods, however, still have some drawbacks that need to be addressed, such as complex instruments, high costs, single patterns, and low resolution.…”
Section: Introductionmentioning
confidence: 99%
“…Electrically conductive electrodes are indispensable for all types of electronic devices, ranging from interconnects to passive elements to functional and integrated devices, and thus the deposition of conductive materials into elaborate patterns via DIW is fundamental yet crucial. In terms of raw materials, metals are more favorable for DIW than carbon-based materials or conducting polymers due to their intrinsically high conductivity and lower cost .…”
Section: Introductionmentioning
confidence: 99%