Direct template-free electrochemical growth of hexagonal CuSn tubes from an ionic liquid

Hsieh, Yi‐Ting; Leong, Tin Iao; Huang, Chih‐Chia; Yeh, Chen-Sheng; Sun, I‐Wen

doi:10.1039/b919298k

Cited by 36 publications

(15 citation statements)

References 27 publications

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“…Figure 3 shows the SEM images of the deposits obtained on a GC substrate by potentiostatic cathodic reduction at ¹2.0 V. Tubular deposits with the inner diameter of 1-1.5 µm were obtained in addition to granular deposits. The deposits with a hexagonal tube shape were obtained in the electrodeposition of not only Sn 7 but also Cu-Sn 12 and Cu-Zn 13 alloys in ionic liquids. Hsieh et al described generation of such pyramidal tubular deposit was due to preferential growth of periphery parts due to the overpotential gradient between the central and periphery parts of nuclei.…”

Section: Resultsmentioning

confidence: 99%

Electrodeposition of Tin in an Amide Type Ionic Liquid Containing Chloride Ion

et al. 2018

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Electrochemical behavior of Sn was investigated on a GC electrode in an aprotic ionic liquid, 1-butyl-1methylpyrrolidinium bis(trifluoromethylsulfonyl)amide (BMPTFSA) containing BMPCl and SnCl 2 at 298 K. SnCl 2 was found to dissolve as [SnCl 4 ] 2− by potentiometry. The formal potential of [SnCl 4 ] 2− /Sn was −1.67 V vs. Ag|Ag(I) (−1.24 V vs. ferrocene|ferrocenium), which was more negative than that in BMPTFSA without chloride ions. Electrodeposition of Sn was possible by reduction of [SnCl 4 ] 2− in the ionic liquid. The dissociation of [SnCl 4 ] 2− was suggested from the diffusion coefficient of [SnCl 4 ] 2− . Tubular deposits with an inner diameter of 1-1.5 µm were obtained in addition to granular deposits by potentiostatic cathodic reduction at −2.0 V.

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Section: Resultsmentioning

confidence: 99%

Electrodeposition of Tin in an Amide Type Ionic Liquid Containing Chloride Ion

et al. 2018

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“…The different sizes of the prisms may result from the initial nucleation time which is related to the concentration of Cu(I) and Sn(II). Higher concentration results from nucleation more easily produced and earlier nucleation formed larger prisms because there is a longer time period for the prism to grow [10].…”

Section: Methodsmentioning

confidence: 99%

“…As known to all, electrodeposition is widely used by industrial production and lab experiments due to its simple process, easy operation, uniform sedimentation, and so on. Furthermore, ionic liquids usually have a wide electrochemical window and show ideal electrolytes for electrodeposition application; it can especially obtain different microstructural platings in ILs [10,11]. Sun et al have reported a method that allowed electrochemical growth of metal alloys from ILs, obtaining a nanotube alloy [11] and a nanowire alloy [12].…”

Section: Introductionmentioning

confidence: 99%

Template-Free Electrochemical Preparation of Hexagonal CuSn Prism-Structural Electrode for Lithium-Ion Batteries

Pan

Zhang

Wen

et al. 2018

Journal of Nanomaterials

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A hexagonal prism CuSn alloy was prepared at room temperature from 1-ethyl-3-methylimidazolium dicyanamide ([Emim][DCA]) by the direct template-free electrodeposition method with different concentrations of Cu(I) and Sn(II) at a low current density of 0.04 A dm −2 . Moreover, the electrodeposition time was also investigated, and the results indicated that the composition of the CuSn alloy became complex and the structure turned unstable with expanding time. The cycling performance of the hexagonal prism-structural CuSn electrode was investigated, with the first discharge capacity of 345 mAh g −1 and a discharge capacity of about 210 mAh g −1 after 10 cycles.

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“…By adjusting deposition potential and solution composition, PdCu, PdSn and PdNi alloys with good electrocatalytic capability were prepared. In an interesting report by Sun and coworkers, free‐standing single crystalline hexagonal Cu 10 Sn 3 hollow tubes were obtained by direct cathodic deposition in [Emim]DCA containing 0.1 m Cu I and 0.05 m Sn II at a low current density of −0.4 mA cm −2 . In a further work, hierarchical single‐crystalline Cu 3 Sn nanobrushes were obtained as the Cu I /Sn II concentration ratio was changed to 1:2.…”

Section: Direct Electrodeposition From Ilsmentioning

confidence: 99%

Electrodeposition in Ionic Liquids

et al. 2015

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Due to their attractive physico-chemical properties, ionic liquids (ILs) are increasingly used as deposition electrolytes. This review summarizes recent advances in electrodeposition in ILs and focuses on its similarities and differences with that in aqueous solutions. The electrodeposition in ILs is divided into direct and template-assisted deposition. We detail the direct deposition of metals, alloys and semiconductors in five types of ILs, including halometallate ILs, air- and water-stable ILs, deep eutectic solvents (DESs), ILs with metal-containing cations, and protic ILs. Template-assisted deposition of nanostructures and macroporous structures in ILs is also presented. The effects of modulating factors such as deposition conditions (current density, current density mode, deposition time, temperature) and electrolyte components (cation, anion, metal salts, additives, water content) on the morphology, compositions, microstructures and properties of the prepared materials are highlighted.

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Direct template-free electrochemical growth of hexagonal CuSn tubes from an ionic liquid

Abstract: Free standing hexagonal hollow copper-tin tube arrays are formed by direct cathodic electrolysis in the 1-ethyl-3-methylimidazolium dicyanamide ionic liquid containing Cu(I) and Sn(II) without using a template at 313 K.

Cited by 36 publications

References 27 publications

Electrodeposition of Tin in an Amide Type Ionic Liquid Containing Chloride Ion

Electrodeposition of Tin in an Amide Type Ionic Liquid Containing Chloride Ion

Template-Free Electrochemical Preparation of Hexagonal CuSn Prism-Structural Electrode for Lithium-Ion Batteries

Electrodeposition in Ionic Liquids

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