Direct silicon bonding dynamics: A coupled fluid/structure analysis

Navarro, E.; Bréchet, Y.; Moreau, R.; Pardoen, Thomas; Raskin, Jean‐Pierre; Barthelemy, A.; Radu, Ionut

doi:10.1063/1.4813312

Cited by 16 publications

(19 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…1, σ ∈ [0.06, 0.12], B ∈ [10 −9 − 10 −4 ). Furthermore, since the bonding speed c ∈ 0.1 − 2 cm/s [5,8,10], the Reynolds number Re = ρh 2 ∞ c/(µL) ≈ 10 −7 1 justifying the lubrication approximation (4). We note that since B 1 and multiplies the highest order derivative in (4) we expect a boundary layer to form near the apparent contact line.…”

Section: Hydrodynamicsmentioning

confidence: 90%

“…Adhesion of thin elastic films to a substrate occurs in a range of problems in physical chemistry [1], in biology [2], and in engineering [3][4][5][6][7][8][9][10]. Experimental and theoretical studies of adhesion focus on the microscale physical chemistry of bond formation [1,11], and the mesoscale mechanics of elastic deformation of the film, and squeeze flow in the gap [12][13][14][15][16][17][18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Elastohydrodynamics of contact in adherent sheets

Carlson¹,

Mandre²,

Mahadevan³

2015

Preprint

View full text Add to dashboard Cite

Adhesive contact between a thin elastic sheet and a substrate in a liquid environment arises in a range of biological, physical and technological applications. By considering the dynamics of this process that naturally couples fluid flow, long wavelength elastic deformations and microscopic adhesion, and solving the resulting partial differential equation numerically, we uncover the shorttime dynamics of the onset of adhesion and the long-time dynamics of a steady propagating adhesion front. Simple scaling laws corroborate our results for characteristic waiting-time for adhesive contact, as well as the speed of the adhesion front. A similarity analysis of the governing partial differential equation further allows us to determine the shape of a fluid filled bump ahead of the adhesion zone. Finally, our analysis yields the boundary conditions for the apparent elastohydrodynamic contact line, generalizing the well known conditions for static elastic contact while highlighting how microscale physics regularizes the dynamics of contact.

show abstract

Section: Hydrodynamicsmentioning

confidence: 90%

Section: Introductionmentioning

confidence: 99%

Elastohydrodynamics of contact in adherent sheets

Carlson¹,

Mandre²,

Mahadevan³

2015

Preprint

View full text Add to dashboard Cite

show abstract

“…Such methods are obviously not adapted for non-transparent substrates as used here. Thus, an indirect procedure was defined based on the out-of-plane displacement profile uy(x) of the specimen, following the earlier work of (Navarro et al, 2013), (Bertholet et al, 2007) and (Olbrechts et al, 2006). The relationship between uy(x) and a can be determined analytically by comparing one arm of the wedge opening test to a beam deformed by an imposed displacement at a distance a from the crack tip.…”

Section: B) Interface Fracture Testsmentioning

confidence: 99%

Interface toughening in multilayered systems through compliant dissipative interlayers

Dépinoy

Strepenne

Massart

et al. 2019

Journal of the Mechanics and Physics of Solids

Self Cite

View full text Add to dashboard Cite

The effect on an interlayer on the toughness of an interface between a ductile thin film and an elastic substrate is investigated by finite element modeling and assessed towards experimental measurements. The model is based on an asymptotic K-field formulation relying on cohesive zone elements to simulate the fracture process. A compliant interlayer tends to increase the interface toughness by promoting plastic dissipation in the thin layer. Additional toughening can result from the development of plastic strains in the interlayer. The magnitude of these two toughening mechanisms depends on the film thickness, among other parameters. The model predictions are confirmed by comparison with wedge-opening test data performed on a multilayer composed of a thin Cu layer and a polymer interlayer embedded between two stainless steel substrates. These findings lay the foundation for the design of tougher multilayers and provide a critical assessment of 2 experimental protocols for interface toughness measurements requiring the bonding of a dummy substrate, such as used for DCB or four point bending tests.

show abstract

“…Then, adhesion forces drive the expansion of the contacted area to the entire wafer area, leading to the bonding front propagation or "contact wave." 7,8 During the propagation, both wafers are significantly deformed in the vicinity of the bonding front, by both the adhesion forces and the pressure coming from the thin film of fluid. 8 In this paper, a model is proposed to take into account the bonding front propagation effect on the final wafer stack curvature.…”

mentioning

confidence: 99%

“…7,8 During the propagation, both wafers are significantly deformed in the vicinity of the bonding front, by both the adhesion forces and the pressure coming from the thin film of fluid. 8 In this paper, a model is proposed to take into account the bonding front propagation effect on the final wafer stack curvature. In addition, the model is validated by accurate experimental measurements.…”

mentioning

confidence: 99%

Influence of the bonding front propagation on the wafer stack curvature

Navarro

Bréchet

Barthelemy

et al. 2014

Applied Physics Letters

Self Cite

View full text Add to dashboard Cite

International audienceThe influence of the dynamics of the direct wafer bonding process on the curvature of the final wafer stack is investigated. An analytical model for the final curvature of the bonded wafers is developed, as a function of the different load components acting during the bonding front propagation, using thin plate theory and considering a strain discontinuity locked at the bonding interface. Experimental profiles are measured for different bonding conditions and wafer thicknesses. A very good agreement with the model prediction is obtained and the influence of the thin air layer trapped in-between the two wafers is demonstrated. The proposed model contributes to further improvement of the bonding process, in particular, for the stacking of layers of electronic devices, which requires a high accuracy of wafer-to-wafer alignment and a very low distortion level

show abstract

Direct silicon bonding dynamics: A coupled fluid/structure analysis

Cited by 16 publications

References 6 publications

Elastohydrodynamics of contact in adherent sheets

Elastohydrodynamics of contact in adherent sheets

Interface toughening in multilayered systems through compliant dissipative interlayers

Influence of the bonding front propagation on the wafer stack curvature

Contact Info

Product

Resources

About