2011
DOI: 10.1002/cphc.201100040
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Direct Patterning of Copper on Polyimide by Site-Selective Surface Modification via a Screen-Printing Process

Abstract: We demonstrate a simple route to fabricating copper circuit patterns on the surface of polyimide film. The copper pattern can be obtained in three steps: 1) Formation of partially potassium hydroxide modified pattern via a screen-printing process, 2) formation of macromolecular metal complex with copper, and 3) copper metallization by DMAB reduction. The morphologies of these copper patterns are determined by cross-sectional transmission electronic microscopy (TEM), scanning electronic microscopy (SEM), and at… Show more

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Cited by 13 publications
(11 citation statements)
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“…When the ion-doped films were dipped into aqueous reduction solutions, such as hydrogen peroxide, hydroquinone, and hydrazine hydrate solutions for several seconds, silver ions reduced rapidly to form silver nanoparticles and these silver nanoparticles can serve as seeds and nuclei during next reduction and growing processes. Herein, aqueous H 2 O 2 solution was selected as the reducant for its relatively weaker reducing power in comparison with other reductants such as glucose, 29 DMAB, 30 hydrazine hydrate, and hydroquinone (Figures S1 and S2, Supporting Information). Then, we can slow down effects of combination and aggregation of newly born silvers, making it possible to observe the evolution processes of silver microdisks by SEM and AFM, which was indispensable to give a possible mechanism of forming continuous silver layers on polymeric substrates.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…When the ion-doped films were dipped into aqueous reduction solutions, such as hydrogen peroxide, hydroquinone, and hydrazine hydrate solutions for several seconds, silver ions reduced rapidly to form silver nanoparticles and these silver nanoparticles can serve as seeds and nuclei during next reduction and growing processes. Herein, aqueous H 2 O 2 solution was selected as the reducant for its relatively weaker reducing power in comparison with other reductants such as glucose, 29 DMAB, 30 hydrazine hydrate, and hydroquinone (Figures S1 and S2, Supporting Information). Then, we can slow down effects of combination and aggregation of newly born silvers, making it possible to observe the evolution processes of silver microdisks by SEM and AFM, which was indispensable to give a possible mechanism of forming continuous silver layers on polymeric substrates.…”
Section: Methodsmentioning
confidence: 99%
“…In fact, the surface of commercial PI films can change into the ion exchangeable precursors via base hydrolysis reaction because the ion-doped precursors have triggered the development of a new concept in metallization of polymer substrates. A variety of techniques have been developed by several groups, on the basis of thermal treatment, photoinduced chemistry, and chemical reduction for metallization of polyimides. However, there are several drawbacks that need to be overcome.…”
Section: Introductionmentioning
confidence: 99%
“…Since they can be modified to be conductive or insulating, magnetic, or nonmagnetic, piezoelectric or nonpiezoelectric, photosensitive or nonphotosensitive (Wilson and Atkinson, ), polyimides can be used in many types of micro electro mechanical systems (MEMS), such as in fingerprint sensors for biometrics (Han and Koshimoto, ), ultrasound scanners (Zara and Smith, ) and in radio frequency micro electro mechanical system (RF MEMS) switches (Ghodsian et al, ). Polyimide film in a device is generally interfaced to another polyimide film, as well as a number of different inorganic materials, such as silicon (Tan et al, ), aluminum (Lin et al, ; Park et al, ), copper (Su et al, ; Xu et al, ), chromium (Cordill et al, ; Noh et al, ) and tungsten (Yao et al, ). At these interfaces, low residual stress and high adhesion strength are necessary to avoid reliability problems due to interfacial mechanical failure.…”
Section: Introductionmentioning
confidence: 99%
“…In general, LDW refers to producing various patterns (such as trademarks, security codes, images, and texts) on the surface of metals, ceramics, woods, polymers, and other materials via physical and chemical changes caused by lasers. Recently, LDW of polymers has received considerable attention. Compared with traditional marking or patterning methods (such as mechanical engraving, spraying, ink printing, and screen printing), , LDW possesses many advantages of being non-contact, highly efficient, highly precise, durable, and environmentally friendly …”
Section: Introductionmentioning
confidence: 99%
“…1−3 Recently, LDW of polymers has received considerable attention. Compared with traditional marking or patterning methods (such as mechanical engraving, spraying, ink printing, and screen printing), 4,5 LDW possesses many advantages of being non-contact, highly efficient, highly precise, durable, and environmentally friendly. 6 Many types of lasers can be chosen for LDW, including excimer lasers, CO 2 lasers, and Nd:YAG lasers.…”
Section: Introductionmentioning
confidence: 99%