Direct patterning and electrospray deposition through EHD for fabrication of printed thin film transistors

Khan, Saleem; Doh, Yang Hoi; Khan, Arshad; Rahman, Ahsan; Choi, Kyung Hyun; Kim, Dong Soo

doi:10.1016/j.cap.2010.11.044

Cited by 76 publications

(52 citation statements)

References 21 publications

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“…Compared to other deposition techniques, electrospray deposition (ESD) offers the advantage of a high deposition efficiency (up to 80%) and a reduction of the process steps [84]. The EHDP has been applied in several fields, mostly at a lab or a pilot scale.…”

Section: Processingmentioning

confidence: 99%

Review on the Processing and Properties of Polymer Nanocomposites and Nanocoatings and Their Applications in the Packaging, Automotive and Solar Energy Fields

et al. 2017

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For the last decades, nanocomposites materials have been widely studied in the scientific literature as they provide substantial properties enhancements, even at low nanoparticles content. Their performance depends on a number of parameters but the nanoparticles dispersion and distribution state remains the key challenge in order to obtain the full nanocomposites’ potential in terms of, e.g., flame retardance, mechanical, barrier and thermal properties, etc., that would allow extending their use in the industry. While the amount of existing research and indeed review papers regarding the formulation of nanocomposites is already significant, after listing the most common applications, this review focuses more in-depth on the properties and materials of relevance in three target sectors: packaging, solar energy and automotive. In terms of advances in the processing of nanocomposites, this review discusses various enhancement technologies such as the use of ultrasounds for in-process nanoparticles dispersion. In the case of nanocoatings, it describes the different conventionally used processes as well as nanoparticles deposition by electro-hydrodynamic processing. All in all, this review gives the basics both in terms of composition and of processing aspects to reach optimal properties for using nanocomposites in the selected applications. As an outlook, up-to-date nanosafety issues are discussed.

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Section: Processingmentioning

confidence: 99%

Review on the Processing and Properties of Polymer Nanocomposites and Nanocoatings and Their Applications in the Packaging, Automotive and Solar Energy Fields

et al. 2017

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“…Electrohydrodynamic (EHD) jet printing is a recently developed advanced technique for noncontact high‐resolution printing that addresses the weaknesses of inkjet printing. Specifically, EHD jet printing provides the following advantages: higher printing resolution (sub‐μm scale), use of higher viscosity printable inks, the ability to change ejection form (e.g., spray mode), and control over the nozzle shape and electric field intensity . An EHD jet printer is comprised of a nozzle, syringe pump, conductive substrate, transition stage, and voltage power supply.…”

Section: Fundamentals Of the Solution Processing Technique For Oxide mentioning

confidence: 99%

A Review of Low‐Temperature Solution‐Processed Metal Oxide Thin‐Film Transistors for Flexible Electronics

Park

Kang

Kim

2019

Adv Funct Materials

302

211

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Solution processing, including printing technology, is a promising technique for oxide thin-film transistor (TFTs) fabrication because it tends to be a costeffective process with high composition controllability and high throughput. However, solution-processed oxide TFTs are limited by low-performance and stability issues, which require high-temperature annealing. This high thermal budget in the fabrication process inhibits oxide TFTs from being applied to flexible electronics. There have been numerous attempts to promote the desired electrical characteristics of solution-processed oxide TFTs at lower fabrication temperatures. Recent techniques for achieving low-temperature (<350 °C) solution-processed and printed oxide TFTs, in terms of the materials, processes, and structural engineering methods currently in use are reviewed. Moreover, the core techniques for both n-type and p-type oxidebased channel layers, gate dielectric layers, and electrode layers in oxide TFTs are addressed. Finally, various multifunctional and emerging applications based on low-temperature solution-processed oxide TFTs are introduced and future outlooks for this highly promising research are suggested.

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“…To balance the perplexities brought about by this top‐down process, the other approach proposed is a bottom‐up process, which is to print the corresponding materials with the technique of assembling the rigid components and soft substrate in a single procedure . Several printing methods (e.g., inkjet printing, electrohydrodynamic printing, aerosol printing, direct ink writing (DIW), etc.) have been introduced to fabricate such soft devices.…”

Section: Introductionmentioning

confidence: 99%

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

Lin

Mao

et al. 2019

Adv Materials Technologies

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of amalgamating rigid elements and nonstretchable components on a soft substrate, strain isolation is proposed as a promising strategy in order to fabricate stretchable devices by incorporating island-bridge structure for these stretchable electronics. [13,14] The original strain isolation is offered by the modulus contrast between rigid components and the soft substrate, but constricted by the materials participating and the thickness of each part, leading to delaminating at the interface created by the components and the substrate. Furthermore, enhanced strain isolation schemes exploit geometrically structured substrates, [15] elastomeric substrates with stiff platforms, [2,16] soft elastomers with liquid-filled cavities, [2,17] and polymer substrates with programmable rigidity. [18] However, these approaches make the fabrication arduous, prompting further problems. Utilizing geometrically structured substrates not only elevates the thickness of the entire device but the substrates need to be pre-strained as well, making the subsequent transfer printing process a taxing affair. Although stiff platforms embedded into elastomeric substrates can fortify brittle components, there is still an adequate chance of occurrence of delamination at the interface of stiff platforms and soft substrates. Liquid filled in cavities of soft elastomers is prone to leakage or evaporation. Considering the scheme of polymer substrate with programmable rigidity, aqueous solution oxidized substrate offers low spatial resolution despite adopting airlaid paper to absorb liquid and confine the oxidized regions. In addition, manual operations are involved in the process, thus curtailing the success rate as well as the efficiency of manufacturing. Hence, these scenarios demand a new method of lamination between rigid components and soft substrates to be developed, which could not only safeguard the brittle parts but also employ a novel process to streamline the preparation.The field of soft electronics boasts microfabrication as its conventional manufacturing method; but in order to create soft electronic devices, it must interweave other approaches with it, like transfer printing. [19,20] To balance the perplexities brought about by this top-down process, the other approach proposed is a bottom-up process, which is to print the corresponding materials with the technique of assembling the rigid components and soft substrate in a single procedure. [21] Several printing methods (e.g., inkjet printing, [22][23][24] electrohydrodynamic printing, [25][26][27] aerosol printing, [28,29] direct ink writing (DIW), [30,31] etc.) have been introduced to fabricate such soft The trend of incorporating soft electronic systems in current electronics framework is fast becoming a wide phenomenon in healthcare as they provide a more suitable human-machine interface making it conveniently possible to achieve real-time, continuous health monitoring and therapy. However, the effective integration of an entire system with the soft and dynamic human skin has prov...

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Direct patterning and electrospray deposition through EHD for fabrication of printed thin film transistors

Cited by 76 publications

References 21 publications

Review on the Processing and Properties of Polymer Nanocomposites and Nanocoatings and Their Applications in the Packaging, Automotive and Solar Energy Fields

Review on the Processing and Properties of Polymer Nanocomposites and Nanocoatings and Their Applications in the Packaging, Automotive and Solar Energy Fields

A Review of Low‐Temperature Solution‐Processed Metal Oxide Thin‐Film Transistors for Flexible Electronics

Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics

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