2012
DOI: 10.1364/oe.20.020564
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Direct fabrication of silicon photonic devices on a flexible platform and its application for strain sensing

Abstract: We demonstrate a process to fabricate silicon photonic devices directly on a plastic film which is both flexible and transparent. This process allows the integration of complex structures on plastic films without the need of transferring from another substrate. Waveguides, grating couplers, and microring resonators are fabricated and optically characterized. An optical strain sensor is shown as an application using 5 µm-radius microring resonators on the flexible substrate. When strain is applied, resonance wa… Show more

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Cited by 60 publications
(40 citation statements)
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References 33 publications
(39 reference statements)
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“…The flexible resonators exhibited an average intrinsic Q value of 110,000. The number is slightly lower compared to devices printed on Si substrates but is 50 times higher than previous reports of monolithically integrated optical resonator structures on flexible substrates [56]. The lower Q is likely due to the inferior surface quality of the flexible substrate.…”
Section: Direct Monolithic Imprint Fabrication On Nonplanar Substratesmentioning
confidence: 60%
“…The flexible resonators exhibited an average intrinsic Q value of 110,000. The number is slightly lower compared to devices printed on Si substrates but is 50 times higher than previous reports of monolithically integrated optical resonator structures on flexible substrates [56]. The lower Q is likely due to the inferior surface quality of the flexible substrate.…”
Section: Direct Monolithic Imprint Fabrication On Nonplanar Substratesmentioning
confidence: 60%
“…Another attempt to demonstrate flexible photonic device was to fabricate photonic device directly on amorphous silicon which is directly deposited onto flexible substrates. [5] The drawback of this method is that the optical characteristic of amorphous silicon is not as good as single crystal silicon. Besides, patterning photonic devices on soft material is not a reliable procedure especially when the feature size is small.…”
Section: Introductionmentioning
confidence: 99%
“…3 However, a-Si:H offers a more flexible fabrication process since it can be deposited at relatively low temperatures (≤300°C) and therefore allows using glass or plastic materials as substrates. 4,5 This facilitates a low-cost fabrication and offers more processing options, e.g., for the combination with microfluidic channels using split-and-recombine micromixers or for the arrangement of the sensing resonators that can be principally fabricated in a vertically stacked configuration.…”
Section: Introductionmentioning
confidence: 99%