1989
DOI: 10.1116/1.584652
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Direct electron-beam patterning for nanolithography

Abstract: An experimental high resolution e-beam system has been developed for direct deposition of microstructures with feature size ≂0.1 μm and below. This system is used to study various aspects of high resolution direct e-beam deposition process, i.e., physical factors which govern the resolution of the process, film characteristics and properties, nucleation of film growth, and pattern aspect ratio capability. For direct e-beam deposition of Au, using organometallic complexes, features with minimum linewidth of ≂30… Show more

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Cited by 59 publications
(21 citation statements)
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“…As shown in Figure 4, the vertical growth rate of SiO x is proportional to the TEOS pressure and the growth behavior is similar to that reported by other groups (Hubner and Plontke 2001, Kohlmann et al 1993, Lee and Hatzakis 1989, Schiffmann 1993. The data show a linear growth rate for lower times and the overall growth rate at low times is proportional to the growth pressure, ranging from 2.3 nm/s at 1 × 10 −3 Pa to 8.6 nm/s at 3.6 × 10 −3 Pa and 21.6 nm/s at 8 × 10 −3 Pa for beam current of 3.78 pA at high pressure, 4.72 pA at medium pressure, 4.68 pA at low pressure.…”
Section: Resultssupporting
confidence: 88%
“…As shown in Figure 4, the vertical growth rate of SiO x is proportional to the TEOS pressure and the growth behavior is similar to that reported by other groups (Hubner and Plontke 2001, Kohlmann et al 1993, Lee and Hatzakis 1989, Schiffmann 1993. The data show a linear growth rate for lower times and the overall growth rate at low times is proportional to the growth pressure, ranging from 2.3 nm/s at 1 × 10 −3 Pa to 8.6 nm/s at 3.6 × 10 −3 Pa and 21.6 nm/s at 8 × 10 −3 Pa for beam current of 3.78 pA at high pressure, 4.72 pA at medium pressure, 4.68 pA at low pressure.…”
Section: Resultssupporting
confidence: 88%
“…103 Data presented in some reports do not allow sufficient quantification to distinguish precisely this behavior but are consistent in the trend that the growth rate is higher at low voltages than at high voltages. 16,22,72,104,105 A different type of behavior is shown in Fig. 21: An increase in the deposit height with increasing energy between 2 and 20 kV, after which the deposit height stays constant or shows a slight decrease.…”
Section: Height and Widthmentioning
confidence: 99%
“…Annealing of lines deposited from Me 2 -Au-tfac or Co 2 ͑CO͒ 8 at temperatures around 300°C gave dewetting instead of wetting: the lines separated into solidified droplets. 104,121,161 Apparently, the a-C matrix had oxidized and disappeared, leaving the ͑oxidized͒ metal grains.…”
Section: Annealingmentioning
confidence: 99%
“…In many organometallic gold precursors, a common component is the bidentate ligand acetylacetonate ͑acac͒, including dimethyl-͑acetylacetonate͒ gold͑III͒ ͓Au III ͑acac͒Me 2 ͔, dimethyl-͑hexafluoroacetylacetonate͒ gold͑III͒ ͓Au III ͑hfac͒ Me 2 ͔, and dimethyl-͑trifuoroacetylacetonate͒ gold͑III͒ ͓Au III ͑tfac͒Me 2 ͔. 3,15,17,18,20,[25][26][27][28][29][30] For example, using Au III ͑acac͒Me 2 , plasmonic gold nanostructures with potential optical applications have been deposited using FEBIP; the same precursor has also been used to solder carbon nanotubes to gold electrodes. Au III ͑tfac͒Me 2 has been used in a͒ Deceased.…”
Section: Introductionmentioning
confidence: 99%