Direct-Current Breakdown Test Method Based on Electrode-Embedded Fully Extruded Molding Crosslinked Polyethylene Sample

Li, Wenpeng; Shi, Xiao‐Ning; Su, Pengfei; Zhao, Xiaolei; Yin, Yi

doi:10.1109/tdei.2022.3148478

Cited by 6 publications

(2 citation statements)

References 19 publications

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“…This has, indeed, been recently reported by Li et al and by Andersson et al in crosslinked polyethylene (XLPE) and low-density polyethylene (LDPE), respectively, for other applications. [27,28] To illustrate the reduced fringing due to encapsulation, Figure 3 shows the variation in the E-field enhancement factor 𝜂 calculated at an electroplated Au electrode edge (5 μm thick and 0.5 μm radius of curvature) as a function of the PI insulating film thickness in the case where the encapsulation is either an insulating oil or a subsequent PI capping overlayer. The enhancement factor 𝜂 increases monotonically with the PI insulating film thickness.…”

Section: State-of-the-art Of Polyimide Breakdown Field Versus Thickne...mentioning

confidence: 99%

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Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Diaham,

Lambkin,

O'Sullivan

et al. 2023

Adv Materials Inter

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To date, the AC dielectric breakdown strength of polyimide (PI) films, as for most polymers, is understood to follow a thickness dependency with a measured power law exponent, n ≈ 0.5. However, this work experimentally demonstrates that the AC dielectric strength of PI films is quasi‐thickness independent. Evidence is presented showing that the thickness dependency described in the literature can be explained by an extrinsic failure mode, driven by partial discharges occurring at the dielectric‐oil‐electrode triple point. Triple points can be avoided by electrode encapsulation, which subsequently recovers a purely intrinsic failure mode for PI films over a large thickness range. Consequently, the AC dielectric strength of thick PI films is intrinsic and quasi‐thickness independent, at least for film thickness up to 60 µm. For the first time, a “theoretical” AC breakdown field for PI films is reported as ≈520 Vrms µm−1. Finally, the highest experimental breakdown field values are obtained here with 505 Vrms µm−1 and 705 Vµm−1 under AC and DC fields, respectively.

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Section: State-of-the-art Of Polyimide Breakdown Field Versus Thickne...mentioning

confidence: 99%

“…This has, indeed, been recently reported by Li et al and by Andersson et al in crosslinked polyethylene (XLPE) and low‐density polyethylene (LDPE), respectively, for other applications. [ 27,28 ]…”

Section: State‐of‐the‐art Of Polyimide Breakdown Field Versus Thickne...mentioning

confidence: 99%

Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Diaham,

Lambkin,

O'Sullivan

et al. 2023

Adv Materials Inter

View full text Add to dashboard Cite

show abstract

Effect of PDMS Concentration on the Flashover Voltage Improvement of Epoxy Resin by Plasma Modification

Chu,

Tian,

Ding

et al. 2024

Springer Proceedings in Physics

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A manual operated and eco-friendly plasma-assisted polymerization method for enhancing surface weather resistance of insulation

Zhu,

Dai,

Guan

et al. 2024

Applied Surface Science

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Direct-Current Breakdown Test Method Based on Electrode-Embedded Fully Extruded Molding Crosslinked Polyethylene Sample

Cited by 6 publications

References 19 publications

Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Effect of PDMS Concentration on the Flashover Voltage Improvement of Epoxy Resin by Plasma Modification

A manual operated and eco-friendly plasma-assisted polymerization method for enhancing surface weather resistance of insulation

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