Direct bonding of silicon nitride to copper via laser surface modification

Song, Yuchen; Zhu, Hao; Liu, Duo; Song, Xiaoguo; Tan, Caiwang; Cao, Jian

doi:10.1016/j.apsusc.2022.154354

Cited by 11 publications

(1 citation statement)

References 26 publications

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“…Numerous research studies have been undertaken on metal-to-ceramic connection technologies in order to employ ceramics in power electronics. At present, there are several types of ceramic metallization, such as molybdenum–manganese metallization [ 7 ], Direct Bonded Copper (DBC) and Active Metal Brazing (AMB) [ 8 ], as well as screen printing with thick film metallization [ 9 ]. Because of its excellent electrical conductivity and ability to sinter in air without the need for environment control, silver (Ag) has been widely employed as an electrode material for the ceramic surface [ 10 ].…”

Section: Introductionmentioning

confidence: 99%

Study on Low-Temperature Conductive Silver Pastes Containing Bi-Based Glass for MgTiO3 Electronic Power Devices

Fu,

Yu,

Liu

et al. 2023

Micromachines

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Low-temperature lead-free silver pastes deserve thorough investigation for sustainable development and application of MgTiO3 ceramics in electronic devices. In this study, a series of Bi2O3-B2O3-ZnO-SiO2-Al2O3-CaO glasses with suitable softening temperatures were prepared via melt quenching using a type of micrometer silver powder formed by silver nanoparticle aggregates. The composite pastes containing silver powder, Bi2O3 glass powder and an organic vehicle were then screen-printed. The effects of glass powder concentration and sintering temperature on the microstructure of the surface interface were also investigated. The results showed that the silver paste for microwave dielectric ceramic filters (MgTiO3) possessed good electrical conductivity (2.28 mΩ/□) and high adhesion (43.46 N/mm2) after medium temperature (670 °C) sintering. Thus, this glass powder has great application potential in non-toxic lead-free silver pastes for metallization of MgTiO3 substrates.

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