Direct bonding copper with alumina and aluminum nitride ceramic substrates

Krasniy, Ivan; Denisova, A. A.; Kumacheva, Svetlana

doi:10.1109/apeie.2016.7807089

Cited by 2 publications

(1 citation statement)

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“…The method of DBC relies on the Cu-Cu 2 O eutectic liquid between copper and the oxide of Cu 2 O on the surface of the ceramic, whereby ceramic/metal joining can successfully occur [14]. Nevertheless, the Cu-Cu 2 O eutectic liquid is hardly formed between AlN ceramic and copper, ascribed to the insu cient amount of oxide on the surface of AlN ceramic [15].…”

Section: Introductionmentioning

confidence: 99%

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Huang

Chen

et al. 2021

J Mater Sci: Mater Electron

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The reliability of wide-bandgap (WBG) semiconductors used as power electronics is closely related to the high thermal conductivity of AlN-metalized substrates. Thus, the bonding of AlN ceramics with metals is a key issue for the production of reliable AlN-metalized substrates. This paper reports on a new method for producing AlN/Cu joints by employing a novel lm-metallization production process, which involves a porous network of Cu layer and Ag foil. The microstructure and the phases formed at the interface of the AlN/Cu joints produced at various brazing temperatures and times, were analyzed by scanning electron microscopy and X-ray diffraction analysis. Strong joints with shear strength of 48.5 MPa were produced after brazing at 850 °C for 10 min. The typical microstructure at the interfacial reaction zone was Cu / Ag(s) + Cu(s) / CuAlO 2 + Al 2 O 3 + Cu(s) / AlN. The experimental results manifest the crucial role of the Ag-Cu eutectic liquid phase, formed by the reaction between the Cu layer and the Ag foil, and of the porous network of the Cu layer deposited on the surface of the AlN ceramic substrate, since both of them effectively favor the reduction of the residual thermal stresses in the joint and result in strong ceramic/metal joins.

show abstract

Section: Introductionmentioning

confidence: 99%

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Huang

Chen

et al. 2021

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous-copper layer and Ag foil

Huang

Chen

et al. 2021

Preprint

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The reliability of wide-bandgap (WBG) semiconductors used as power electronics is closely related to the high thermal conductivity of AlN-metalized substrates. Thus, the bonding of AlN ceramics with metals is a key issue for the production of reliable AlN-metalized substrates. This paper reports on a new method for producing AlN/Cu joints by employing a novel film-metallization production process, which involves a porous network of Cu layer and Ag foil. The microstructure and the phases formed at the interface of the AlN/Cu joints produced at various brazing temperatures and times, were analyzed by scanning electron microscopy and X-ray diffraction analysis. Strong joints with shear strength of 48.5 MPa were produced after brazing at 850 °C for 10 min. The typical microstructure at the interfacial reaction zone was Cu / Ag(s) + Cu(s) / CuAlO2 + Al2O3 + Cu(s) / AlN. The experimental results manifest the crucial role of the Ag-Cu eutectic liquid phase, formed by the reaction between the Cu layer and the Ag foil, and of the porous network of the Cu layer deposited on the surface of the AlN ceramic substrate, since both of them effectively favor the reduction of the residual thermal stresses in the joint and result in strong ceramic/metal joins.

show abstract

Direct bonding copper with alumina and aluminum nitride ceramic substrates

Cited by 2 publications

References 0 publications

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous-copper layer and Ag foil

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