Direct Attach of Photonic Components on Substrates With Optical Interconnects

Glebov, Alexei L.; Uchibori, Chihiro J.; Lee, M.G.

doi:10.1109/lpt.2007.893901

Cited by 4 publications

(1 citation statement)

References 9 publications

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“…However, the implementation of optical waveguide in a commercial PCB imposes severe restrictions on the materials and processes like low propagation loss, high thermal stability, cost effective fabrication, and etc. Currently, polymer based waveguide is the most popular choice for optical interconnect due to its low cost, suitability for mass production, high thermal stability and low optical loss [1][2][3][4][5][6][7][8][9][10][11][12][13].…”

Section: (1) Introductionmentioning

confidence: 99%

Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

Lau¹,

Lim²,

Lim³

et al. 2008

SPIE Proceedings

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In this study, a low-cost (with bare chips) and high (optical, electrical, and thermal) performance optoelectronic system with a data rate of 10Gbps is designed and analyzed. This system consists of a rigid printed circuit board (PCB) made of FR4 material with an optical polymer waveguide, a vertical cavity surface emitted laser (VCSEL), a driver chip, a 16:1 serializer, a photo-diode detector, a Trans-Impedance Amplifier (TIA), a 1:16 deserializer, and heat spreaders. The bare VCSEL, driver chip, and serializer chip are stacked with wire bonds and then solder jointed on one end of the optical polymer waveguide on the PCB via Cu posts. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are stacked with wire bonds and then solder jointed on the other end of the waveguide on the PCB via Cu posts. Because the devices in the 3D stacking system are made with different materials, the stresses due to the thermal expansion mismatch among various parts of the system are determined.

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Section: (1) Introductionmentioning

confidence: 99%

Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

Lau¹,

Lim²,

Lim³

et al. 2008

SPIE Proceedings

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Optical Backplanes, Board and Chip Interconnects

Michalzik

2008

Handbook of Fiber Optic Data Communication

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Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Lau

Zhang

Lee

2011

Journal of Electronic Packaging

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A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid PCB (or a substrate) with an embedded optical polymer waveguide, an embedded vertical cavity surface emitted laser (VCSEL), an embedded driver chip, an embedded serializer, an embedded photo-diode detector, an embedded tans-impedance amplifier (TIA), an embedded deserializer, embedded heat slugs, and a heat spreader. The bare VCSEL, driver chip, and serializer chip are 3D stacked and then attached on one end of the embedded optical polymer waveguide in the PCB. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are 3D stacked and then attached on the other end of the embedded optical polymer waveguide in PCB. The back-side of the driver or serializer and the TIA or deserializer chips is attached to a heat slug with or without a spreader. This novel structural design offers potential solutions for low-cost and high-performance semiconductor circuits with optical devices to realize wide-bandwidth and low-profile optoelectronic packaging for chip-to-chip optical interconnect applications. Optical, thermal management, and mechanical performances are demonstrated by simulations based on the optic theory, heat-transfer theory, and continuum mechanics.

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Direct Attach of Photonic Components on Substrates With Optical Interconnects

Cited by 4 publications

References 9 publications

Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

Design and analysis of 3D stacked optoelectronics on optical printed circuit boards

Optical Backplanes, Board and Chip Interconnects

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

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