1973
DOI: 10.1149/1.2403322
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Dimethylamine Borane as the Reducing Agent in Electroless Plating Systems

Abstract: composition of such a complex cannot be deduced from our results. We only know that the Sn: Pd ratio is about 2:1 and that an excess of C1 is present before heating in water. Whether the Pd occurs in a univalent or a bivalent state is not known.No suggestion can be made about the mechanism of initiation of the nickel deposition of the nucleated glass surface. We could not detect a metallic film after a treatment with a hypophosphite solution. Possibly the Sn-Pd complex reduces the nickel-ions. Further study is… Show more

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Cited by 47 publications
(30 citation statements)
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“…In the case of EN-B reduced by dimethylamine borane, this issue is less significant as the bath works in acid media, and most parts of the baths are stabilized by organic acids such as boric acid [140], sodium citrate [141], sodium lauryl sulfate [10] and gluconic acid [142].…”
Section: Traditional Stabilizers and Environmental Issuesmentioning
confidence: 99%
“…In the case of EN-B reduced by dimethylamine borane, this issue is less significant as the bath works in acid media, and most parts of the baths are stabilized by organic acids such as boric acid [140], sodium citrate [141], sodium lauryl sulfate [10] and gluconic acid [142].…”
Section: Traditional Stabilizers and Environmental Issuesmentioning
confidence: 99%
“…Such non-uniform silver growth is likely a result of the fast reaction between the silver cations and glucose. Besides using conventional glucose for reduction, previously reported silver growth methods employing, for example, sodium borohydride or dimethylamine borane species as reducing agents unavoidably lead to the generation of hydrogen gas during the reactions [32,33]. Hydrogen bubbles can take over the nucleation sites on the surface of the CNTs and interfere in the morphology and coverage ratio of silver nanoparticles.…”
Section: Silver Nanoparticle Growth On M-cntsmentioning
confidence: 99%
“…It shows good reactivity towards noble metals at ambient temperature. This reductant has been widely used in electroless deposition of gold (Sadik et al, 2005; or palladium (Lelental, 1973), although application for synthesis of platinum or gold nanoparticles was also reported (Hüttl et al, 2009;.…”
Section: Introductionmentioning
confidence: 99%