Dimensional optimization of microchannel heat sinks with multiple heat sources

Türkakar, Göker; Okutucu-Özyurt, Tuba

doi:10.1016/j.ijthermalsci.2011.12.015

Cited by 37 publications

(9 citation statements)

References 11 publications

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“…While this result is certainly in line with the results discussed in Figs. 11 and 13, their conclusions are only partly correct; it must be noted that Türkakar and Okutucu-Özyurt [63] did not capture the full spectrum of channel aspect ratio so as to observe the presence of either a maxima or a minima. Their domain of findings was limited, essentially based on a single value of conductivity ratio k sf and only three values of channel aspect ratios.…”

Section: Summary and Closurementioning

confidence: 97%

“…Türkakar and Okutucu-Özyurt [63] have studied geometrical optimization of rectangular-shaped heat sinks made of silicon microchannels by minimizing the total thermal resistance. Four different analytical models of optimization, valid for uniform heat load condition (without any conjugate effects) and based on the work of Liu and Garimella [34], were used and subsequently improved by considering the entrance effects and property variations.…”

Section: Summary and Closurementioning

confidence: 99%

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Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Khandekar

Moharana

2015

Springer Tracts in Mechanical Engineering

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Recent developments during the last decade in the field of manufacturing and development of many high-power mini-/micro-devices led to increased interest in microfluidic devices involving heat transfer. Since the pioneering work by Tuckerman and Pease (IEEE Electron Device Lett 2:126-129, 1981) on the use of microchannels for high heat flux removal, certainly a lot of developments has been witnessed through ever-increasing analytical, experimental, and highly sophisticated numerical studies by many researchers across the globe. In spite of this progress, many fundamental understandings of flow and heat transfer phenomena in mini-/microchannel systems are still obscure. One such phenomenon is the flow of heat in the solid wall of microchannel systems by means of conduction normally in a direction opposite to that of internal convective mini-/microchannel flow of fluid, called "axial wall conduction" or "axial back conduction." Axial back conduction is not a new phenomenon, rather mostly neglected unintentionally because of its convincingly smaller influence on heat transfer in conventional-size channels. As the hydraulic diameter of a channel decreases, the coupling between the substrate and bulk fluid temperatures becomes significant because of the relative size of the fluid to the solid wall. Unlike in conventional-size channels, negligence of axial back conduction along the solid walls of micro heat exchangers frequently leads to erroneous conclusions and inconsistencies in the interpretation of transport data. Thus, it is important to explicitly identify the thermofluidic parameters of interest which lead to a distortion in the boundary conditions and thus the true estimation of species transfer coefficients. In this chapter, we focus our attention on the axial back conduction in the solid substrate/channel wall as against the axial back conduction in the liquid flow domain; thus, a detailed review of the state-of-the-art on axial back conduction in both conventional as well as mini-/microchannel systems is presented.

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Section: Summary and Closurementioning

confidence: 97%

Section: Summary and Closurementioning

confidence: 99%

Axial Back Conduction through Channel Walls During Internal Convective Microchannel Flows

Khandekar

Moharana

2015

Springer Tracts in Mechanical Engineering

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“…The effect of channel width and wall thickness on minimising thermal resistance has been investigated by Türkakar and Özyurt [15]. A microchannel aspect ratio of 10 (height-towidth ratio), minimum wall thickness of 20µm and minimum channel width of 40 µm were considered as manufacturing constraints.…”

Section: Introductionmentioning

confidence: 99%

Liquid cooling of non-uniform heat flux of a chip circuit by subchannels

Al-Waaly

Paul

Dobson

2017

Applied Thermal Engineering

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(2017) Liquid cooling of non-uniform heat flux of a chip circuit by subchannels. Applied Thermal Engineering, 115, pp. 558-574. (doi:10.1016Engineering, 115, pp. 558-574. (doi:10. /j.applthermaleng.2016 This is the author's final accepted version.There may be differences between this version and the published version. You are advised to consult the publisher's version if you wish to cite from it. AbstractExperimental and numerical analyses have been carried out to study the effect of using subchannels in a liquid cooled heat sink for minimising the effect of hotspots generated on a chip or circuit. Two heat sinks -with and without subchannels -were fabricated in order to investigate this effect. The first device was manufactured with normal parallel channels while the second was designed to extract more heat by dividing the main channels above the hotspot into two subchannels. The inlet and outlet manifolds were designed with two inlet ports to minimise any potential mal-distribution of mass flow rate through the channels. Three thermocouples were attached to the bottom surface of the inlet manifold and another three attached to the outlet manifold to record surface temperature. Five different mass flow rates were generated under gravity by changing water container height. The results show that adding subchannels improves the uniformity of temperature distribution and reduces the maximum temperature. Moreover, at the same pressure head 79cm the thermal resistance is reduced 20% whereas the pumping power is increased by 11%.

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“…Besides decreasing the dimension of flow passage to improve the heat transfer ability per unit area of conventional heat exchangers [1][2][3][4][5][6][7], other novel techniques are used to enhance the thermal performance of such systems like using converging flow passages [8][9][10], geometrical optimizations [11][12][13][14][15], or filling the flow passages with porous materials [16][17][18][19][20][21]. Microchannels have been used in industries and researches from electronic cooling to biotechnology.…”

Section: Introductionmentioning

confidence: 99%