Diffusivity variation in Electromigration failure

Dwyer, Vincent M.

doi:10.1016/j.microrel.2012.06.057

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“…6 The electromigration flux is governed by various factors, including diffusivity. A simulation study 7 reported that the diffusivity in a solder joint is affected by grain size, grain orientation, and interface layer thickness. Defects such as dislocation in the grain structure also affect the diffusion behavior.…”

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High dislocation density of tin induced by electric current

et al. 2015

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A dislocation density of as high as 1017 /m2 in a tin strip, as revealed by high resolution transmission electron microscope, was induced by current stressing at 6.5 x 103 A/ cm2. The dislocations exist in terms of dislocation line, dislocation loop, and dislocation aggregates. Electron Backscattered Diffraction images reflect that the high dislocation density induced the formation of low deflection angle subgrains, high deflection angle Widmanstätten grains, and recrystallization. The recrystallization gave rise to grain refining.

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