Diffusion in the titanium-nickel system: I. occurrence and growth of the various intermetallic compounds

Bastin, G.F.; Rieck, G. D.

doi:10.1007/bf02644146

Cited by 154 publications

(55 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…4,5) For the ternary system we found only the data of van Vucht [6] on structures of compounds in the quasi-binary system TiNis-TiCos without any indication of the temperature and data on the same concentration range by Sinha [ '71 at 750 "C.…”

Section: Introductionmentioning

confidence: 99%

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Loo¹,

Bastin²

1981

Journal of the Less Common Metals

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Loo¹,

Bastin²

1981

Journal of the Less Common Metals

View full text Add to dashboard Cite

show abstract

“…Selected area diffraction (SAD) and electron dispersive spectroscopy (EDS) analysis of the former phase indicated that it was an fcc-structured TiC (Figure 3), while the intermetallic phase was a Ti 2 (Ni,Pd) phase ( Figure 3) isostructural with the face-centered-cubic Ti 2 Ni phase found in binary Ti-rich NiTi alloys. [17] It should be noted that the presence of O has been shown to stabilize a Ti 4 Ni 2 O x phase in NiTi alloys. [18,19] This phase has the same lattice parameter and crystal structure as the Ti 2 Ni phase since O resides interstitially in the Ti 4 Ni 2 O x phase, which also makes it hard to detect.…”

Section: A Compositional and Microstructural Characterizationmentioning

confidence: 99%

Characterization of Ternary NiTiPd High-Temperature Shape-Memory Alloys under Load-Biased Thermal Cycling

Bigelow

Padula

Garg

et al. 2010

Metall Mater Trans A

129

View full text Add to dashboard Cite

While NiTiPd alloys have been extensively studied for proposed use in high-temperature shapememory applications, little is known about the shape-memory response of these materials under stress. Consequently, the isobaric thermal cyclic responses of five (Ni,Pd) 49.5 Ti 50.5 alloys with constant stoichiometry and Pd contents ranging from 15 to 46 at. pct were investigated. From these tests, transformation temperatures, transformation strain (which is proportional to work output), and unrecovered strain per cycle (a measure of dimensional instability) were determined as a function of stress for each alloy. It was found that increasing the Pd content over this range resulted in a linear increase in transformation temperature, as expected. At a given stress level, work output decreased while the amount of unrecovered strain produced during each load-biased thermal cycle increased with increasing Pd content, during the initial thermal cycles. However, continued thermal cycling at constant stress resulted in a saturation of the work output and nearly eliminated further unrecovered strain under certain conditions, resulting in stable behavior amenable to many actuator applications.

show abstract

“…However, in some systems non-parabolic growth without an incubation time has been observed at low temperatures, where some interface reaction or short-circuit diffusion such as grain boundary diffusion predominates. 7,8) The present paper reports the reaction diffusion studies between pure metals Ti-X (X = Fe, Ni, Cr, Co, Cu, Ag and Au). It has been shown that the Arrhenius plots of k 2 of theTi solid solutions, designated as (-Ti(X)), are bent downward at lower temperatures.…”

Section: Introductionmentioning

confidence: 99%

Growth Kinetics of β-Ti Solid Solution in Reaction Diffusion

Taguchi¹,

Tiwari

Iijima

2003

Mater. Trans.

View full text Add to dashboard Cite

The growth kinetics of the -Ti solid solution phases in several pure metal diffusion couples have been investigated. The layer growth ofTi solid solution phases is observed to obey the parabolic law, indicating that the rate controlling process is diffusion. The temperature dependence of the rate constant of the layer growth shows a linear relationship in the Arrhenius plots at higher temperatures. On the other hand, it deviates from the linearity at low temperatures. This deviation from the linearity is shown to be related to the variation of compositional range of the -Ti solid solution with temperatures. Additionally, the activation energy for the layer growth is found to be equal to sum of the activation energy for interdiffusion and the formation enthalpy of -Ti solid solution in the eutectoid temperature range.

show abstract

Diffusion in the titanium-nickel system: I. occurrence and growth of the various intermetallic compounds

Cited by 154 publications

References 3 publications

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Characterization of Ternary NiTiPd High-Temperature Shape-Memory Alloys under Load-Biased Thermal Cycling

Growth Kinetics of β-Ti Solid Solution in Reaction Diffusion

Contact Info

Product

Resources

About

Diffusion in the titanium-nickel system: I. occurrence and growth of the various intermetallic compounds

Cited by 154 publications

References 3 publications

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Phase relations and diffusion paths in the Ti-Ni-Co system at 900 °C

Characterization of Ternary NiTiPd High-Temperature Shape-Memory Alloys under Load-Biased Thermal Cycling

Growth Kinetics of &beta;-Ti Solid Solution in Reaction Diffusion

Contact Info

Product

Resources

About

Growth Kinetics of β-Ti Solid Solution in Reaction Diffusion