Diffusion bonding of TiAl using reactive Ni/Al nanolayers and Ti and Ni foils

Simões, Sónia; Viana, Filomena; Koçak, M.; Ramos, Adriana; Vieira, M.T.; Vieira, Manuel F.

doi:10.1016/j.matchemphys.2011.02.059

Cited by 59 publications

(31 citation statements)

References 35 publications

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“…14 It requires a combination of high temperature and high pressure to obtain an intimate contact, and relatively long time to ensure sufficient mutual diffusion. As a solid-state joining process, diffusion bonding eliminates the problems of segregation, solidification cracking, and over-interfacial reactions usually found in brazing process.…”

Section: Introductionmentioning

confidence: 99%

“…But high joining temperature inevitably induces high stress between heterogeneous materials. In order to overcome this problem, solutions such as adding soft interlayer 15 or using nanoscale multilayer 14 have been applied in diffusion bonding. Recently, a method of in situ synthesized TiB whiskers (TiBw) was successfully introduced in the brazing process by adding TiB 2 16 or B power 17 as boron source.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Diffusion bonding of ZrB2–SiC/Nb with in situ synthesized TiB whiskers array

Yang

Lin

et al. 2012

Journal of the European Ceramic Society

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Diffusion bonding of ZrB2–SiC/Nb with in situ synthesized TiB whiskers array

Yang

Lin

et al. 2012

Journal of the European Ceramic Society

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“…The exothermic reaction was augmented by resistive heating (current was supplied for 2 min) and facilitated a diffusion of elements across the contact plane. The attempts to join materials with the use of reactive multilayer foils, carried up till now, were performed through heating in vacuum furnaces, like in case of Simoes et al . The latter experiment was a kind of diffusion bonding of TiAl base material with Ni(V)/Al multilayers through heat treatment at up to 900 °C for at least 30 min and under a load of 5 MPa.…”

Section: Discussionmentioning

confidence: 99%

“…On the other hand, there were many attempts to join materials with the use of Ni(V)/Al multilayers relying on diffusion bonding method (i.e. without additional solder layer) like those carried out by Simoes et al . However, a significant disadvantage of this technique is that it requires carrying out of the process in a vacuum furnace at high temperatures and pressures for relatively long times (including that necessary to reach the required temperature).…”

Section: Introductionmentioning

confidence: 99%

Reactive resistance welding of Ti6Al4V alloy with the use of Ni(V)/Al multilayers

Maj

Mars

Morgiel

et al. 2017

Physica Rapid Research Ltrs

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The freestanding Ni(V)/Al multilayer foil was applied as a filler material in order to join Ti6Al4V alloy with the use of reactive resistance welding (RRW) technique. Present investigations, performed with the use of transmission electron microscopy (TEM) method, allowed to show that an application of high current (I = 400 A for 2 min in vacuum conditions ∼10–1 mbar) transformed the Ni(V)/Al multilayers into fine grain (<300 nm) NiAl phase. It also showed that the RRW process led to the formation of firm connection with nanoporosity limited only to the original contact plane between base material and the foil. Simultaneously, the formation of a narrow strip of crystallites of Ti3Al intermetallic phase elongated along the joint line (average size of ∼200 nm) was observed. The base material was separated from the joint area by a layer of up to ∼2 μm thickness of nearly defect free α‐Ti and β‐Ti grains from a heat affected zone (HAZ). The performed experiment proved that Ni(V)/Al multilayer could serve as a filler material for joining of Ti6Al4V alloys even without additional solder layer. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)

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“…These fillers can be used with solder/brazing alloys or as stand-alone heat sources. The heat released by the exothermic reaction of Ni/Al multilayer foils can be used to melt brazing alloys, e.g., [4,11,12], or to enhance the diffusion bonding process by taking advantage of their exothermic and nanocrystalline character, e.g., [6,13]. Its application in the self-healing of cracks in metallic materials is new, and is the least studied.…”

Section: Introductionmentioning

confidence: 99%

Coating of Tungsten Wire with Ni/Al Multilayers for Self-Healing Applications

Ramos

Maj

Morgiel

et al. 2017

Metals

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Self-healing materials are able to partially or completely reverse the damage inflicted on them. The possibility of self-healing mechanical and chemical failures that occur during service will improve the lifetime and reliability of structural materials. For this purpose, two main steps must be considered: (i) detection, and (ii) repairing (healing) of cracks. The exothermic character of reactive multilayers has potential for self-healing applications, namely in the healing step. In this context, Ni(V)/Al multilayer thin films were deposited onto tungsten wires by magnetron sputtering from two targets. A detailed microstructural characterization was carried out by scanning and transmission electron microscopy after deposition, as well as after ignition by applying an electrical discharge. The as-deposited films presented an irregular layered structure with local defects not observed for flat substrates, although Ni-and Al-rich nanolayers could be distinguished. The as-reacted films were constituted by Al 3 Ni 2 grains with Al 3 V phase at the grain boundaries. In order to use reactive multilayers for self-healing purposes, the heat released must be maximised by improving the microstructure of the nanolayered films. Nevertheless, after ignition, the Ni(V)/Al multilayer films deposited onto W wire underwent a self-sustained reaction, releasing heat.

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Diffusion bonding of TiAl using reactive Ni/Al nanolayers and Ti and Ni foils

Cited by 59 publications

References 35 publications

Diffusion bonding of ZrB2–SiC/Nb with in situ synthesized TiB whiskers array

Diffusion bonding of ZrB2–SiC/Nb with in situ synthesized TiB whiskers array

Reactive resistance welding of Ti6Al4V alloy with the use of Ni(V)/Al multilayers

Coating of Tungsten Wire with Ni/Al Multilayers for Self-Healing Applications

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