Diffusion Bonding of Cu&amp;ndash;Cu with Al&amp;ndash;Ni Nano Multilayers

Zhang, Yupeng; Yang, Yanqi; Yi, Jianglong.; Hu, Haibo

doi:10.2320/matertrans.md201221

Cited by 5 publications

(3 citation statements)

References 4 publications

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“…Finally, the bonded samples were gradually cooled to room temperature at a rate of 5 C/min. The shear strength of the as-bonded ceramic-metal joint was measured by the method according to Zhang et al 6) , as shown in Fig. 2.…”

Section: Methodsmentioning

confidence: 99%

“…In Zhang s work, 6) he developed a formula to calculate the reaction heat of Al-Ni nano multilayers with equal atomic ratio in the self-propagating process based on the work of Kim et al 7) Due to the similarity of two reactions, this formula (1) can be used to estimate the reaction heat of Al-Ti nano-multilayers self-propagation reaction.…”

Section: Microstructure Analysis On Different Jointsmentioning

confidence: 99%

See 1 more Smart Citation

Characterization of Al/Ti Nano Multilayer as a Jointing Material at the Interface between Cu and Al2O3

Yi¹,

Zhang²,

Wang³

et al. 2016

Mater. Trans.

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In this paper, a series of Al/Ti multilayers with different modulation periods were used in copper and Al 2 O 3 ceramic diffusion bonding. The reactive multilayer was deposited by DC magnetron sputtering, and the diffusion bonding experiments were performed at 900 C for 10 min with a pressure of 5 MPa. The interfacial joints were inspected by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction and tensile shear tests. As a result, no signi cant metallurgical defect was observed in the microstructures of the joints. The formation of several intermetallic compounds at the interface, such as Cu/Ti eutectic and Al 2 O 3-X ·TiO compound, has further con rmed the success of Cu-Al 2 O 3 bonding as compared to the Al/Ni nano-multilayers, which use Al/Ti nano-foils as interlayer for diffusion bonding to bring more bene t to the quality of cermet joint.

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Section: Methodsmentioning

confidence: 99%

Section: Microstructure Analysis On Different Jointsmentioning

confidence: 99%

Characterization of Al/Ti Nano Multilayer as a Jointing Material at the Interface between Cu and Al2O3

Yi¹,

Zhang²,

Wang³

et al. 2016

Mater. Trans.

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“…In recent studies, toward the practical use of the reactive bonding technique, researchers in related work understand well that there are several technical problems such as cracking, (11) void generation, (12) mechanical weakness, (13,14) and high thermal resistance. (15) The authors are working on controlling the NiAl-solder interface and are attempting to reduce the number of voids and cracks at solder joints.…”

Section: Introductionmentioning

confidence: 99%

Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint

Kanetsuki¹,

Miyake²,

Namazu³

2019

Sensors and Materials

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In this study, a free-standing Al/Ni exothermic multilayer is fabricated and used as a heat source for reactive soldering, instead of an Al/Ni film directly deposited on the solder layer. The free-standing film enables us to reduce not only cracking in the reacted NiAl layer but also voiding at the NiAl-solder interface. These positive effects have successfully resulted in the reduction in the thermal resistance of the joint. Electron probe microanalysis (EPMA) and electron backscattering diffraction (EBSD) analyses suggest that reducing the thermal resistance has been caused by mechanical strain originating from volume shrinkage induced by the Al/Ni exothermic reaction as well as heat conduction from the reactive film to the solder layer. The mechanism of reducing the number of voids is discussed in light of stress distribution during reactive bonding.

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Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers

Zhang

Jiang

Luo

et al. 2014

Rare Metal Materials and Engineering

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Diffusion Bonding of Cu–Cu with Al–Ni Nano Multilayers

Cited by 5 publications

References 4 publications

Characterization of Al/Ti Nano Multilayer as a Jointing Material at the Interface between Cu and Al<sub>2</sub>O<sub>3</sub>

Characterization of Al/Ti Nano Multilayer as a Jointing Material at the Interface between Cu and Al<sub>2</sub>O<sub>3</sub>

Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint

Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers

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