Diffusion Bonding 321-Grade Stainless Steel: Failure and Multimodal Characterization
Isac Lazar,
Axel Knutsson,
Hector Pous Romero
et al.
Abstract:Vacuum diffusion-bonded printed circuit heat exchangers are an attractive choice for the high-temperature, high-pressure demands of next-generation energy applications. However, early reports show that the high-temperature materials desired for these applications suffer from poor bond strengths due to precipitation at the bond line, preventing grain boundary migration. In this study, a diffusion bond of the high-temperature stainless steel grade 321H is investigated, and poor mechanical properties are found to… Show more
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