Diffusion along migrating and stationary grain boundaries in the CuAg system

Gust, W.; Beuers, J.; Steffen, J.; Stiltz, Sibylle; Predel, B.

doi:10.1016/0001-6160(86)90113-6

Cited by 27 publications

(10 citation statements)

References 13 publications

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“…Therefore, understanding the precipitate kinetics is necessary to optimize the precipitate and distribution of Ag in proeutectic Cu. Moreover, the investigation of precipitation and dissolution could be also applied to clarify the Ag diffusion theories along migrating or stationary grain boundaries [9,10]. Two (discontinuous and continuous) precipitation reactions are strongly dependent on the silver content [11].…”

Section: Introductionmentioning

confidence: 99%

“…As the Ag composition was less than 8 wt.%, the Cu-rich solid solutions were transformed into structures with rod-like Ag-rich precipitations embedded in Cu-rich matrix by discontinuous precipitation. Coarse precipitates from the high-angle grain boundaries were generated [9,10,12,13]. The estimated activation energy of Ag precipitation [10,12,14], growth direction, morphology and habit planes [15] were reported.…”

Section: Introductionmentioning

confidence: 99%

“…Coarse precipitates from the high-angle grain boundaries were generated [9,10,12,13]. The estimated activation energy of Ag precipitation [10,12,14], growth direction, morphology and habit planes [15] were reported. Whereas the silver content was more than 8 wt%, a sufficient volume fraction of eutectics suppressed discontinuous precipitation by the absence of grain boundaries and fine precipitates were observed by continuous precipitation mode.…”

Section: Introductionmentioning

confidence: 99%

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Precipitation and dissolution of Ag in ageing hypoeutectic alloys

Zuo

Han

Zhao

et al. 2015

Journal of Alloys and Compounds

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a b s t r a c tUnderstanding the precipitate kinetics of Ag in proeutectic Cu is valuable to optimize the precipitation and morphology of Ag for high strength high conductivity hypoeutectic Cu-Ag alloys. The precipitation behaviors of as-solution treated Cu28 wt.%Ag alloys were analyzed by differential scanning calorimetric (DSC). The results indicated that the activation energies of Ag-rich phase formation and dissolution were 55.3 ± 22.4 kJ/mol and 129.1 ± 20.7 kJ/mol, respectively. The as-solution alloy was further aged at different temperatures for 2 h. Their microhardness and electrical resistivity were measured. The results demonstrated that at the ageing temperature of 405°C, less scattering effects reflected more Ag precipitations from Cu matrix than the rest of temperatures. At 475°C, however, Ag precipitates produced more strengthening effects. Above results were related to the competition between precipitation and dissolution of Ag in proeutectic Cu. This interpretation is supported by TEM observations on Ag precipitation.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Precipitation and dissolution of Ag in ageing hypoeutectic alloys

Zuo

Han

Zhao

et al. 2015

Journal of Alloys and Compounds

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“…Double-seam DP morphology took place as a result of the growth in opposite directions from the initial grain-boundary configuration. [10,11] TEM observations of various DP cells in the FA specimen revealed that silver precipitates in cells had an elongated shape along a <110> direction of the silver-depleted copper matrix.…”

Section: B Precipitation Morphologymentioning

confidence: 99%

“…Ag alloy aged at 573 K. The DP cell consists of lamellae of the rod-shaped silver-rich phase and solute-depleted phase. [10,11] It has been found that not only the cell growth rate but also the growth direction of discontinuous silver precipitates depends on the sense of the applied stress and the cell growth direction. The dependences of the cell growth rate and the morphology of silver precipitates on the sense of the applied stress can be explained by the interaction energy between the external stress and the misfit strains of silver precipitates.…”

Section: Introductionmentioning

confidence: 99%

Influence of External Stress on Discontinuous Precipitation Behavior in a Cu-Ag Alloy

Monzen

Terazawa

Watanabe

2010

Metall Mater Trans A

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The influence of an applied stress on discontinuous precipitation (DP) has been investigated for a Cu-5 wt. pct. Ag alloy aged at 573 K. A tensile stress enhances the growth of DP cells in both the loading direction (LD) and transverse direction (TD), but the cell growth rate in the TD, v CT , is faster than that in the LD, v CL . A compressive stress suppresses the cell growth in the TD, but does not significantly influence it in the LD. The tensile or compressive stress tends to produce discontinuous silver precipitates elongated in a <110> direction of the copper matrix in a DP cell, nearly perpendicular to or parallel to the LD. This result, along with the dependence of the cell growth rate on the sense of the applied stress, can be understood through the interaction energy between the external stress and the misfit strains of silverprecipitates. An analysis of length-change measurement results has enabled estimation of the ratio of the growth rate of silver precipitates in the TD, v PT , to that in the LD, v PL , under tension or compression. The estimated values of v PT / v PL are in good agreement with the values of v CT / v CL , experimentally obtained, indicating that the anisotropy of the cell growth rate is determined by the growth behavior of silver precipitates.-3 -

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A resistometric study of migrating boundary characteristics in Pb-Sn alloys

Manna

Pabi

1988

Phys. Stat. Sol. (a)

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Diffusion along migrating and stationary grain boundaries in the CuAg system

Cited by 27 publications

References 13 publications

Precipitation and dissolution of Ag in ageing hypoeutectic alloys

Precipitation and dissolution of Ag in ageing hypoeutectic alloys

Influence of External Stress on Discontinuous Precipitation Behavior in a Cu-Ag Alloy

A resistometric study of migrating boundary characteristics in Pb-Sn alloys

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