2020
DOI: 10.1364/oe.413020
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Diffraction-based overlay metrology using angular-multiplexed acquisition of dark-field digital holograms

Abstract: In semiconductor device manufacturing, optical overlay metrology measures pattern placement between two layers in a chip with sub-nm precision. Continuous improvements in overlay metrology are needed to keep up with shrinking device dimensions in modern chips. We present first overlay metrology results using a novel off-axis dark-field digital holographic microscopy concept that acquires multiple holograms in parallel by angular multiplexing. We show that this concept reduces the impact of source intensity flu… Show more

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Cited by 19 publications
(14 citation statements)
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“…In our current setup, we use free-space coupling to project illumination beams on the wafer and the reference beams on the camera. However, we have shown previously 11 that we can also use fiber coupling which we will implement as one of the next steps in this investigation.…”
Section: Methodsmentioning
confidence: 99%
See 4 more Smart Citations
“…In our current setup, we use free-space coupling to project illumination beams on the wafer and the reference beams on the camera. However, we have shown previously 11 that we can also use fiber coupling which we will implement as one of the next steps in this investigation.…”
Section: Methodsmentioning
confidence: 99%
“…We propose to measure overlay (OV) of μDBO gratings using a dark-field digital holographic microscope. Our df-DHM microscope has already been extensively reported previously 11 and is schematically shown in Fig. 1.…”
Section: Operating Principlementioning
confidence: 99%
See 3 more Smart Citations