2013 UKSim 15th International Conference on Computer Modelling and Simulation 2013
DOI: 10.1109/uksim.2013.130
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Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder

Abstract: Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single solder joint with varied parameters are briefly discussed. A suitable lead-free solder is used in this study which is Sn-3.5Ag-0.7Cu. Simple Single Factor (S… Show more

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Cited by 2 publications
(3 citation statements)
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“…The DOE technique is a low cost and quick method to understand and optimize variables of the RIE process in this work. The main effect is used to estimate and analyze the effect of factor [5][6][7][8]. The following equation of DOE: Main effect of a factor = Average response at high level -Average response at low level [5][6][7][8] The results of grain size after RIE process is measured by using AFM and light reflectance on surface of specimen is analyzed by using Lambda 950 were shown in Table 1.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The DOE technique is a low cost and quick method to understand and optimize variables of the RIE process in this work. The main effect is used to estimate and analyze the effect of factor [5][6][7][8]. The following equation of DOE: Main effect of a factor = Average response at high level -Average response at low level [5][6][7][8] The results of grain size after RIE process is measured by using AFM and light reflectance on surface of specimen is analyzed by using Lambda 950 were shown in Table 1.…”
Section: Resultsmentioning
confidence: 99%
“…The main effect is used to estimate and analyze the effect of factor [5][6][7][8]. The following equation of DOE: Main effect of a factor = Average response at high level -Average response at low level [5][6][7][8] The results of grain size after RIE process is measured by using AFM and light reflectance on surface of specimen is analyzed by using Lambda 950 were shown in Table 1. From the Table 1, test specimen 14 has the highly value of grain size compared to other specimen which is 112800.00 nm.…”
Section: Resultsmentioning
confidence: 99%
“…The DOE is a low cost and quick method to understand and optimize variables of the RIE process in this study. The main effect is used following equation to estimate the effect of factor [6,7]: Main effect of a factor = Average response at high level -Average response at low level [6,7] The effects of temperature, vacuum, RF power and gaseous on surface roughness are calculated and the results are -4.184, 0.009, 3.534 and 16.701. From the results, effect of temperature is negative when the average surface roughness at low level is higher than average…”
Section: Resultsmentioning
confidence: 99%