2021
DOI: 10.1016/j.nanoen.2021.105948
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Different dimensional nanoadditives for thermal conductivity enhancement of phase change materials: Fundamentals and applications

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Cited by 219 publications
(68 citation statements)
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“…Finally, 3D nanoadditives have recently received increasing interest due to their inherent 3D conductive networks. [74] At present, researchers generally increase the heat transfer efficiency of PCM by the addition of other highly thermally conductive materials, such as porous skeleton with high thermal conductivity, metal foam, nanoscale particles, and so on. The new CPCM has a relatively high thermal conductivity.…”
Section: D Structure Additivesmentioning
confidence: 99%
“…Finally, 3D nanoadditives have recently received increasing interest due to their inherent 3D conductive networks. [74] At present, researchers generally increase the heat transfer efficiency of PCM by the addition of other highly thermally conductive materials, such as porous skeleton with high thermal conductivity, metal foam, nanoscale particles, and so on. The new CPCM has a relatively high thermal conductivity.…”
Section: D Structure Additivesmentioning
confidence: 99%
“…Recent reviews mainly concentrate on the encapsulation strategies, thermal conductivity enhancement, and applications of PCMs in energy conversion and storage ( Aftab et al., 2018 ; Chandel and Agarwal, 2017 ; Chen et al., 2020g ; Cheng et al., 2021 ; Frigione et al., 2019 ; Li and Mu, 2019 ; Shchukina et al., 2018 ; Wu et al., 2021b ; Yuan et al., 2020 ), or focus on the preparations, properties and applications of flexible PCMs ( Shi et al., 2021 ). However, an insightful understanding of flexible engineering of advanced PCMs is still insufficient.…”
Section: Introductionmentioning
confidence: 99%
“…The latter limits theirs charging/discharging rates during solidification/melting processes. This issue can be overcome with the use of solid nanoparticles [6,7] or porous medium/solid foam [8] to tailor thermal transport properties of the "composite" material. In this framework, research is currently directed on the macroscale optimization of device's configurations to achieve higher performances [9].…”
Section: Introductionmentioning
confidence: 99%