Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration

Zhou, Q.; Zhou, Y.; Qin, X.; Wang, X. J.; Huang, M. L.

doi:10.1109/isaf.2014.6918059

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M 2014

DOI: 10.1109/isaf.2014.6918059

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Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration

Q. Zhou¹,

Y. Zhou²,

X. Qin³

et al.

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Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration

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