Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

Diaham, Sombel; Locatelli, Marie-Laure; Valdez-Nava, Zarel

doi:10.5772/24397

Cited by 11 publications

(4 citation statements)

References 30 publications

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“…Different metal and ceramic materials provide different performances in module packaging. TABLE IV lists a comparison among four normally used ceramic materials [56]- [59]. Among all choices, Al 2 O 3 is the most economic choice but has the highest thermal impedance and moderate mechanical strength.…”

Section: A Substratementioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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Abstract-Silicon-Carbide (SiC) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging becomes a limiting factor in fully realizing the benefits offered by SiC power devices, and thus, improved and advanced packaging structures are required to bridge the gap between SiC devices and their applications. This paper provides a review of the state-of-art advanced module packaging technologies for SiC devices with the focuses on module layout, packaging material system, and module integration trend, and links these packaging advancements to their impacts on the SiC device performances. Through this review, the paper discusses main challenges and potential solutions for SiC modules, which is critical for future SiC applications.Index Terms-Packaging material system, power module integration, SiC advanced packaging.

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Section: A Substratementioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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“…Reliability of the substrate is often related to the mechanical properties of the ceramic material coupled with the metal being used. With the development of the new wide bandgap semiconductors, such as SiC or GaN, higher voltages along with higher current densities could potentially increase the insulating requirements imposed on the ceramic materials inside the substrates [2].…”

Section: Modules and Ceramicsmentioning

confidence: 99%

Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules

Jouini¹,

Valdez-Nava²,

Malec³

2016

ENG

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High voltage power modules are used in numerous applications to build high power converters. Technically, these modules are made of different materials and among them, dielectric materials are organic and inorganic. Organic insulators (gels) are used to avoid corona discharges in the vicinity of connecting wires and high voltage dies (diodes and transistors) and to protect them from moisture and contaminants. Inorganic insulators (ceramic substrates) are used to insulate the high voltage which dies from the grounded elements and to transfer heat to the heat sink. Despite being used since the late 90s, there is a lack of fundamental knowledge about the electrical properties of these substrates. Consequently, manufacturers tend to assure the reliability by over sizing them. As there are no clear rules for how to do that, failures occur, leading to the converter shutdown. The aim of this study is to bring new information about the understanding of the dielectric strength of ceramic materials used in these modules. We have focused our work on the correlation between the mechanical and the dielectric properties of ceramics by using relevant experiments. We provide new information about the impact of existing cracks on the ceramic dielectric failure, according to the electromechanical breakdown model. Our conclusions bring crucial information about the precautions to be taken during manufacturing and implementation of these substrates in power modules to reduce the likelihood of the particular causes of failure.

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“…For high temperature applications, parylene HT was found to be an attractive encapsulating material. Indeed, according to Diaham et al [13], this material can operate at high temperature (≤ 600°C…”

Section: Migration Of Silvermentioning

confidence: 99%

Migration issues in sintered-silver die attaches operating at high temperature

Riva

Buttay

Allard

et al. 2013

Microelectronics Reliability

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Silver sintering is a promising alternative to high melting point (HMP) solders which contain lead. Indeed, it offers better thermal and electrical properties, and can operate at higher temperature. However, silver tends to migrate in presence of electric field, oxygen (or moisture) and high temperature, causing short circuits. In this paper, we assess the extend of this issue, and we evaluate the protective effect of a thin layer of parylene. It is shown that silver migration occurs rapidly (tens to hundred of hours at 300°C), but that parylene offers a good mitigation of this issue.

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Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

Abstract: Hard cover, 546 pagesPublisher InTech

Cited by 11 publications

References 30 publications

A Review of SiC Power Module Packaging: Layout, Material System and Integration

A Review of SiC Power Module Packaging: Layout, Material System and Integration

Failure Analysis of Ceramic Substrates Used in High Power IGBT Modules

Migration issues in sintered-silver die attaches operating at high temperature

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