Dielectric‐State Analysis in Solid‐Solution Pb(Yb1/2Ta1/2)O3–Pb(Lu1/2Nb1/2)O3

The dependence of abnormal grain growth (AGG), also termed secondary recrystallization, on annealing temperature in the range between 600 ЊC and 1050 ЊC has been observed in pure bulk Cu specimens compressed to various levels between 5 and 75 pct. There is no grain texture after annealing. The average grain size after primary recrystallization, which represents the initial grain size for secondary recrystallization during further annealing, decreases with increasing deformation and is nearly independent of the annealing temperature, in agreement with previous observations. The incubation time for AGG decreases and the number density of abnormally large grains increases with increasing deformation (hence, a decreasing initial grain size) and increasing annealing temperature. At low temperatures, most of the grain boundaries are faceted, with some facet planes probably of singular structures corresponding to cusps in the polar plots of the grain-boundary energy vs the grain-boundary normal. With increasing temperature, the grain boundaries become defaceted and, hence, atomically rough. The observed grain-growth behavior appears to be qualitatively consistent with the movement of faceted grain boundaries by two-dimensional nucleation of boundary steps. The temperature dependence appears to be consistent with roughening of grain boundaries. Before the onset of AGG, stagnant growth of the grains occurs at low rates, probably limited by slow two-dimensional nucleation of boundary steps, and, at low deformations and low annealing temperatures, the stagnant growth persists for 100 hours. The specimens with relatively small initial grain sizes (because of high deformation) show double AGG when annealed at high temperatures.

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The effect of small deformation on abnormal grain growth in bulk Cu

Koo

Yoon

Henry

2002

Metall Mater Trans A

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The effect of small deformation below the level (about 8 pct) required for primary recrystallization on abnormal grain growth (secondary recrystallization) has been investigated in bulk polycrystalline Cu. The starting microstructure, without any texture and with a nearly uniform grain size of 168 m, has been obtained by compressing a cylindrical Cu specimen and recrystallizing at 800 ЊC. The fully recrystallized specimen shows distinct abnormal grain growth (AGG) after heat treatment at 800 ЊC for 12 hours. Most of the grain boundaries are faceted when observed under transmission electron microscopy (TEM), and most of the faceted segments are expected to be singular. A singular grain boundary free of defects will migrate by two-dimensional nucleation of new layers, with its velocity varying nonlinearly with the driving force arising from the grain-size difference. Such a growth mechanism is analogous to the well known process for the growth of crystals with singular surfaces from liquid or vapor. The grains slightly larger than the average size will hardly grow, because the driving force for their growth is not sufficient for nucleation of new crystal layers at the boundaries. Those grains larger than a certain critical size will, however, grow at ever-increasing rates with their increasing size, because of the sufficient driving force for two-dimensional nucleation. Such a selective accelerated growth of large grains results in overall AGG behavior. The specimen deformed to 2 pct shows AGG after heat treatment for only 5 minutes at 800 ЊC, and after 1 hour, large impinged grains are obtained. The grain boundaries show many extrinsic dislocations even after the heat treatments. As proposed earlier by Gleiter, Balluffi, Smith, and their colleagues, the extrinsic grain-boundary dislocations increase the grain-boundary mobilities even at low driving forces, and, hence, even those grains slightly larger than the average size can rapidly grow at the early stages of the heat treatment, in agreement with the observation. In the specimens deformed to 4 to 8 pct, below the level for primary recrystallization, all grains grow steadily without producing distinct AGG. With high densities of extrinsic dislocations at the grain boundaries even after long heat treatments, all grains can readily grow, resulting in overall growth patterns resembling the normal growth. When deformed to 20 and 50 pct, primary recrystallization occurs, and the subsequent AGG behavior depends on the grain size obtained at the completion of the primary recrystallization. Similar small-deformation effects are observed with heat treatment at 600 ЊC.

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Dielectric‐State Analysis in Solid‐Solution Pb(Yb_1/2Ta_1/2)O₃–Pb(Lu_1/2Nb_1/2)O₃

Cited by 31 publications

References 18 publications

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Abnormal grain growth in bulk Cu—The dependence on initial grain size and annealing temperature

The effect of small deformation on abnormal grain growth in bulk Cu

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