Dielectric properties of inorganic fillers filled epoxy thin film

Norshamira, A.; Mariatti, M.

doi:10.1063/1.4919159

Cited by 3 publications

(1 citation statement)

References 11 publications

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“…Meanwhile, with the same thickness, the thermal enhancement capacity of the graphene owning a large lateral size is always higher than that of the smaller one. In addition to the above reports, some other typical graphene-based composites fabricated by the melt-blending process are also listed in Table 2 [29,31,33,[40][41][42][43][44][45][46][47][48].…”

Section: Randomly Dispersed Graphenementioning

confidence: 99%

Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review

Ying

Dai

et al. 2022

Sci. China Phys. Mech. Astron.

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With the explosive development in integration of electronic components and the increasing complexity of packaging systems, semiconductor chips own extremely high operation temperatures given by the horrible heat accumulation attributed to the drastically increasing power density. Therefore, highly efficient heat dissipation with the help of rationally designed thermal interface materials (TIMs) is the key to maintaining the device performance and lifespan. Graphene exhibits an ultrahigh intrinsic thermal conductivity, which has attracted a large amount of academic interest due to its significant potential for developing highperformance TIMs. In this tutorial review, we summarize the recent advances in graphene-based TIMs, especially emphasizing the determinate effects of graphene structure and alignment in enhancing the heat transfer capacity of corresponding samples, with detailed discussion in the superiorities and limitations of various graphene skeletons. In addition, we also provide prospects for the challenges and opportunities in the future development of graphene-based TIMs.

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Section: Randomly Dispersed Graphenementioning

confidence: 99%

Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review

Ying

Dai

et al. 2022

Sci. China Phys. Mech. Astron.

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Thickness Dependent Structural and Dielectric Properties of Calcium Copper Titanate Thin Films Produced by Spin-Coating Method for Microelectronic Devices

Thiruramanathan¹,

Lee

Marikani³

et al. 2017

Journal of Elec Materi

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Fabrication, mechanical, thermal, and electrical characterization of epoxy/silica composites for high-voltage insulation

Amin

Ali

Khattak

2017

Science and Engineering of Composite Materials

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For improved performance of epoxy, its composites were studied for high-voltage insulation. Epoxy composites may offer several advantages over neat epoxy and ceramic materials. We fabricated nano- and microepoxy/silica composites with 5 wt% nanosilica and 20 wt% microsilica, respectively. The composites and neat epoxy were studied for thermal, mechanical, and electrical properties. A thermogravimetric analyzer was used for analyzing wt% loss with temperature. Tensile and hardness tests were performed according to DIN 53504/ASTM D412 and DIN 53505/ASTM D2240 standards, respectively. Electrical properties such as dielectric strength and resistivity were tested according to IEC-60243-1 and ASTM D257/IEC 60093 standards, respectively. Neat epoxy, microcomposite, and nanocomposite showed 50% weight loss at 392°C, 410°C, and 421°C, respectively. At 550°C, nanocomposite remained at 20% of its initial weight whereas neat epoxy and microcomposite remained at 10% of their initial weights. Microcomposite and nanocomposite showed tensile strengths of 65.7 Mpa and 69.3 Mpa, respectively. Enhancements of 8% and 19% in dielectric strength were recorded for microcomposites and nanocomposites, respectively. Nanosilica greatly improved surface and volume resistivity whereas microsilica showed negligible effect on resistivity.

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Dielectric properties of inorganic fillers filled epoxy thin film

Cited by 3 publications

References 11 publications

Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review

Rational design of graphene structures for preparing high-performance thermal interface materials: A mini review

Thickness Dependent Structural and Dielectric Properties of Calcium Copper Titanate Thin Films Produced by Spin-Coating Method for Microelectronic Devices

Fabrication, mechanical, thermal, and electrical characterization of epoxy/silica composites for high-voltage insulation

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