Dielectric properties of highly filled thermoplastics for printed circuit boards

Apeldorn, Thomas; Keilholz, Clemens; Wolff‐Fabris, Felipe; Altstädt, Volker

doi:10.1002/app.38602

Cited by 34 publications

(19 citation statements)

References 46 publications

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“…The organic part of a PCB is mainly epoxy resin or thermoplastics with contents of flame-retardants and paper, which are used as insulating substrate for PCBs and encapsulation of electronic components [7], [25], [26]. Plastics are mainly C-H-O and halogenated polymers.…”

Section: A Printed Circuit Boards (Pcbs)mentioning

confidence: 99%

e-WASTE: Everything an ICT Scientist and Developer Should Know

2019

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Every dazzling announcement of a new smart phone or trendy digital device is the prelude to more tons of electronic waste (e-waste) being produced. This e-waste, or electronic scrap, is often improperly added to common garbage, rather than being separated into suitable containers that facilitate the recovery of toxic materials and valuable metals. We are beginning to become aware of the problems that e-waste can generate to our health and the environment. However, most of us are still not motivated enough to take an active part in reversing the situation. The aim of this article is to contribute to increase this motivation by pointing out the significant problem that e-waste represents and its social and environmental implications. We have chosen this forum in which multidisciplinary researchers in ICT from all countries access on regularly to explain the serious problems we are exposed to when we do not make a responsible and correct use of technology. In this paper, we also survey the composition of contemporary electronic devices and the possibilities and difficulties of recycling the elements they contain. As researchers, our contributions in science enable us to find solutions to current problems and to design more and more powerful intelligent devices. But responsible researchers must be aware of the negative effects that this industry causes us and, consequently, assume their commitment with more sustainable designs and developments. Therefore, the knowledge of e-waste issues is crucial also in the scientific world. Researchers should consider this problem and contribute to minimize it or find new solutions to manage it. These must be the additional challenges in our projects.

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Section: A Printed Circuit Boards (Pcbs)mentioning

confidence: 99%

e-WASTE: Everything an ICT Scientist and Developer Should Know

2019

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“…The loss factor indicates how much signals get lost during this way [4]. The results of the measurements of the dielectric properties of e-lignin 21 and e-lignin 24 and the reference material FR 4 are summarized in Table 4.…”

Section: Dielectric Propertiesmentioning

confidence: 99%

Lignin as renewable raw material for applications in electronics

Patermann¹,

Altstädt²

2016

AIP Conference Proceedings

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Abstract. In the long term, renewable raw materials should be used as favorite materials for applications in the electronic industry, but very high specifications for substrate materials make the use of biopolymers in electronics difficult. In this work, thermoplastic lignin is used as renewable raw material for electronic applications, precisely for a substrate material for printed circuit boards (PCBs). The results show that lignin-based substrate materials in a thickness range of 0.5 mm respectively 0.8 mm can successfully be produced via film extrusion using a slot die followed by a calender unit. With a glass fiber reinforcement content of ~24 vol. %, the substrate material shows good mechanical behavior (tensile tests and falling dart tests). The water absorption and the adhesion of the copper foil are in the range of FR 4, which is the standard substrate material for printed circuit boards. However, the maximum operating temperature, the time to delamination and the coefficient of thermal expansion are below the values of FR 4. Nevertheless, the developed lignin based substrate material can successfully be used as a prototype circuit board in a non-automated process.

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“…In recent years, there has been a great deal of interest in printed circuit board (PCB) material development for high‐frequency applications . To transmit high frequencies, the dielectric properties of the components need to be adjusted, such as low permittivity to reduce signal propagation delay and low dielectric loss factor to minimize signal losses that are otherwise converted into heat . Additionally, there is a need to develop highly thermally conducting base materials for PCB due to increasing miniaturization and integration of electronic components, which also has attracted considerable attention .…”

Section: Introductionmentioning

confidence: 99%

“…Additionally, there is a need to develop highly thermally conducting base materials for PCB due to increasing miniaturization and integration of electronic components, which also has attracted considerable attention . Further challenges in PCB material development are to adjust the coefficient of thermal expansion (CTE) of the substrate to match the CTE of the copper circuits (17 ppm/K), as well as to keep or even improve the mechanical properties …”

Section: Introductionmentioning

confidence: 99%

Thermal, dielectric, and mechanical properties of h‐BN‐filled PTFE composites

Zimmermann-Ptacek

Muggli²,

Wildhack³

et al. 2018

J of Applied Polymer Sci

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In order to obtain materials for improved printed circuit boards (PCBs) with high thermal conductivity and low dielectric losses, hexagonal boron nitride (h-BN) was incorporated into a polytetrafluoroethylene (PTFE) matrix. The filler loading in the composite was varied up to a filler volume content of 50%. Thermal conductivity and coefficient of thermal expansion (CTE) were investigated with respect to filler orientation. Further dielectric and mechanical properties were investigated. The incorporation of h-BN improved the heat transport significantly, while the loss factor decreased. Fillers with a higher aspect ratio have a greater effect on increasing thermal conductivity. For a filler volume loading of 30%, the in-plane thermal conductivity was up to 14 times higher than the thermal conductivity of the matrix, while the loss factor decreased slightly. The permittivity increased with the increasing filler volume content, while the CTE also decreased. Though the filler affects the mechanical properties negatively, 40% of the tensile strength could be maintained if a filler volume content of 30% is not exceeded. Such compositions may be used as raw materials for future printed circuit boards.

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Dielectric properties of highly filled thermoplastics for printed circuit boards

Cited by 34 publications

References 46 publications

e-WASTE: Everything an ICT Scientist and Developer Should Know

e-WASTE: Everything an ICT Scientist and Developer Should Know

Lignin as renewable raw material for applications in electronics

Thermal, dielectric, and mechanical properties of h‐BN‐filled PTFE composites

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