2009
DOI: 10.1002/app.30663
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Dielectric properties and solubility of multilayer hyperbranched polyimide/polyhedral oligomeric silsesquioxane nanocomposites

Abstract: Multilayer hyperbranched polyimide/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were synthesized by the reaction of a bromidehyperbranched polyether/POSS and a main-chain polyimide containing hydroxyl-functional groups. The first layer was formed through the direct reactions of the main-chain hydroxyl groups with monochloroisobutyl polyhedral oligomeric silsesquioxane (POSS-Cl). The second and third layers were prepared by the repeated reactions of bromine ether branches that incorporated POSS-Cl… Show more

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Cited by 10 publications
(2 citation statements)
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“…Moreover, properties of polymers like the transport of charge carriers are strongly related to the segmental dynamics. It has been demonstrated that nanofillers offer a possibility to tailor and optimize the dielectric and conductive properties of HBPs [17][18][19]. Thus, knowledge of the structure and the dynamics of HBPs and their nanocomposites are important to widen their range of potential applications.…”
mentioning
confidence: 99%
“…Moreover, properties of polymers like the transport of charge carriers are strongly related to the segmental dynamics. It has been demonstrated that nanofillers offer a possibility to tailor and optimize the dielectric and conductive properties of HBPs [17][18][19]. Thus, knowledge of the structure and the dynamics of HBPs and their nanocomposites are important to widen their range of potential applications.…”
mentioning
confidence: 99%
“…The Dow Chemical Company has already commercialized a polyphenylenebased product under the trade name SiLK™ with dielectric constant value of 2.65 [321]. Somboonsub et al [322] prepared multilayer hb-PI/POSS nanocomposites synthesized by the incorporation of POSS into the side chains of polyimide. The lowest dielectric constant value attained was 2.54 in the hb-PI/POSS nanocomposite because of the large free volume and loose polyimide structures.…”
Section: -55mentioning
confidence: 99%