2018
DOI: 10.1109/jsen.2018.2808948
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Dielectric Modulated Biosensor Architecture: Tunneling or Accumulation Based Transistor?

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Cited by 68 publications
(47 citation statements)
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“…no. TFET-based biosensors ON state current sensitivity (S ON ) 1 Lateral DM HTFET (L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 40 ] 10 2 Single pocket DM TFET ( L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 40 ] 40 3 SiGe source DM PNPN TFET (L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 10 ] 4 × 10 3 4 Double gate (DG) TFET (L gap = 30 nm, L gate = 40 nm, k = 12) [ 11 ] 1.05 × 10 2 5 DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) (V GS = 0.6 V) [ 26 ] ~ 8 × 10 5 6 Ge source DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) [ 26 ] 6 × 10 5 7 InAs source DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) [ 26 ] 8 × 10 5 8 Charge plasma based DM NT-TFET (L gap = 10 nm, 50 nm, L gate = 20 nm & 11 nm, k = 8) [ 41 ] ~ 50 9 Diagonal tunneling based DM NT-TFET (L gap = 95 nm, L gate = 50 nm + 45 nm, k = 10) [ 11 ] ~ 10 10 10 Dual channel trench gate biosensor (L gap = 90 nm, L gate ...…”
Section: Resultsmentioning
confidence: 99%
“…no. TFET-based biosensors ON state current sensitivity (S ON ) 1 Lateral DM HTFET (L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 40 ] 10 2 Single pocket DM TFET ( L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 40 ] 40 3 SiGe source DM PNPN TFET (L gap = 20 nm, L Ch = 42 nm, k = 2.1) [ 10 ] 4 × 10 3 4 Double gate (DG) TFET (L gap = 30 nm, L gate = 40 nm, k = 12) [ 11 ] 1.05 × 10 2 5 DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) (V GS = 0.6 V) [ 26 ] ~ 8 × 10 5 6 Ge source DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) [ 26 ] 6 × 10 5 7 InAs source DM NT-TFET (L gap = 50 nm, L gate = 50 nm, k = 10) [ 26 ] 8 × 10 5 8 Charge plasma based DM NT-TFET (L gap = 10 nm, 50 nm, L gate = 20 nm & 11 nm, k = 8) [ 41 ] ~ 50 9 Diagonal tunneling based DM NT-TFET (L gap = 95 nm, L gate = 50 nm + 45 nm, k = 10) [ 11 ] ~ 10 10 10 Dual channel trench gate biosensor (L gap = 90 nm, L gate ...…”
Section: Resultsmentioning
confidence: 99%
“…In proposed structure, a cavity is carved in gate dielectric and filled with biomolecules to realize the function of the label free biosensor. Many authors [11], [41], [42] have reported that the size of the biomolecules (protein,biotin,gelatin etc.) lies within 10 nm cavity thickness.…”
Section: Device Structurementioning
confidence: 99%
“…The fabrication process flow of SOI-TFETs has been reported by several authors [26,32,33] and the compatibility with the recent CMOS technology is investigated extensively. Thus, the fabrication of the segmented drain SiGe/Si TFET is a real possibility as shown in Fig.…”
Section: Device Modelling and Simulationmentioning
confidence: 99%
“…2. The process initiates with a Silicon On Insulator (SOI) structure [32][33][34]. The N-type drain region can be formed using Difluoroboron (BF 2 ) ion implantation followed by etching for the N + layer deposition (CVD technique).…”
Section: Device Modelling and Simulationmentioning
confidence: 99%