Dielectric investigation of the effect of fillers and plasticizers on molecular mobility in an epoxide resin

Krasnobokii, Yu. N.; Dushchenko, V. P.; Duginov, V. E.; Baranovskii, V. M.; Luchitskii, P. G.

doi:10.1007/bf00892591

Cited by 2 publications

(2 citation statements)

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“…As a comparison we have also given the results for one specimen at atmospheric pressure up to 380 K. This specimen had been cured for 12 h at 440 K, and thus its h(T) does not conform to equation (1). The temperature dependence of the thermal conductivity below the glass transition temperature Tg has been studied by several authors (Cherkasova 1959, Kline 1961, Knappe 1961, Baranovskii et al 1967, Garrett and Rosenberg 1974. The general tendency of h is to increase linearly with increasing temperature.…”

Section: Resultsmentioning

confidence: 99%

The thermal properties of an epoxy resin at high pressure and temperature

Sundqvist

Sandberg

Bäckström

1977

J. Phys. D: Appl. Phys.

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The thermal conductivity lambda , thermal diffusivity and heat capacity per unit volume has been measured for an epoxy resin, Araldite AW 106, with hardener HV 953 U. Measurements have been carried out at room temperature up to 2.5 GPa and between 300 and 430K at 0.11 and 0.27 GPa. The glass transition temperature and its pressure (P) dependence have been determined. The quantity delta lambda / delta P was found to change abruptly in the temperature region of the glass transition.

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Section: Resultsmentioning

confidence: 99%

The thermal properties of an epoxy resin at high pressure and temperature

Sundqvist

Sandberg

Bäckström

1977

J. Phys. D: Appl. Phys.

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“…Considering the heat conduction chain formed by the interaction of particles, the shape and relative content of particles, and other factors, the following equation is obtained [172,181,182]:…”

Section: Agari Modelmentioning

confidence: 99%

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

Zhang

Zhou

et al. 2020

J. Compos. Sci.

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At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

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Dielectric investigation of the effect of fillers and plasticizers on molecular mobility in an epoxide resin

Cited by 2 publications

References 1 publication

The thermal properties of an epoxy resin at high pressure and temperature

The thermal properties of an epoxy resin at high pressure and temperature

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

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