2015
DOI: 10.1016/j.tsf.2015.01.005
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Dielectric and mechanical properties and thermal stability of polyimide–graphene oxide composite films

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Cited by 72 publications
(30 citation statements)
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“…28 Chen minghua 29 found that the mechanical property, thermal conductivity, and electric conductivity clearly increased with the addition of a small amount of GO. Dong et al 30 prepared GO/ PI composite bres with ODA-modied GO and found that the incorporation of graphene greatly improved the thermal stability and hydrophobic behaviour of the composite bre.…”
Section: 2427mentioning
confidence: 99%
“…28 Chen minghua 29 found that the mechanical property, thermal conductivity, and electric conductivity clearly increased with the addition of a small amount of GO. Dong et al 30 prepared GO/ PI composite bres with ODA-modied GO and found that the incorporation of graphene greatly improved the thermal stability and hydrophobic behaviour of the composite bre.…”
Section: 2427mentioning
confidence: 99%
“…In fact, the dielectric properties are very sensitive to the addition of these nanoparticles because the energy density has quadratic dependence on the electric field intensity. Monotonic reduction of the electrical breakdown appears by increasing the metal-oxide nanoparticles [11,12,13,14,15,16,17]. This can be analyzed considering randomly dispersed nanoparticles which form percolation networks which can prematurely break down the material, in particular at the high loading rates of TiO 2 and BaTiO 3 .…”
Section: Introductionmentioning
confidence: 99%
“…[51,52] Moreover, polyimide (PI) is widely used in microelectronics and aerospace fields due to its comprehensively excellent properties. [53,54] However, PI polymer materials still encounter problems such as difficult processing and high cost.…”
Section: Farid Bakir Is Professor At Arts Et Métiers Paristech Andmentioning
confidence: 99%