2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/eptc56328.2022.10013112
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Diebond Process Optimization and Surface Characterization to Eliminate Conductive Die Attach Film to Ag Plated Pad Delamination due to Intrinsic High Aspect Ratio Ultrathin Die Warpage and Bow Level

Marty Lorgino Pulutan1,
Olga Rivera2
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